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BQ3050DBT

Texas Instruments

BQ3050DBT by Texas Instruments

BQ3050DBT by Texas Instruments is a Power Management IC with 38 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 3.8V to 25V and peak reflow temperature of 260°C. Ideal for industrial applications requiring power supply management circuits in compact spaces.

Median Price

$16.250

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,600 parts In-Stock

1+ parts

$16.250

100+ parts

$14.194

1k+ parts

$9.789

10k+ parts

-

1,600

$16.250

$14.194

$9.789

-

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$26.000

100+ parts

$16.480

1k+ parts

$16.000

10k+ parts

-

6

$26.000

$16.480

$16.000

-

Rochester

USA . 12 parts In-Stock

1+ parts

-

100+ parts

$14.150

1k+ parts

$12.660

10k+ parts

$11.910

12

-

$14.150

$12.660

$11.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,569 parts In-Stock

1+ parts

$12.920

100+ parts

-

1k+ parts

-

10k+ parts

-

4,569

$12.920

-

-

-

Vyrian

USA . 3,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,137

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,170 parts In-Stock

1+ parts

$1.268

100+ parts

-

1k+ parts

$2.033

10k+ parts

-

1,170

$1.268

-

$2.033

-

DigiPath Technology Company

USA . 1,840 parts In-Stock

1+ parts

$1.396

100+ parts

$1.285

1k+ parts

-

10k+ parts

-

1,840

$1.396

$1.285

-

-

ChromeModa Solutions

Germany . 2,492 parts In-Stock

1+ parts

$1.425

100+ parts

$1.168

1k+ parts

-

10k+ parts

-

2,492

$1.425

$1.168

-

-

IDEA Electronic Components Group

UK . 2,032 parts In-Stock

1+ parts

$1.425

100+ parts

-

1k+ parts

$1.282

10k+ parts

-

2,032

$1.425

-

$1.282

-

Semicontronic

India . 276 parts In-Stock

1+ parts

$11.560

100+ parts

$11.271

1k+ parts

$11.213

10k+ parts

-

276

$11.560

$11.271

$11.213

-

Ampacity Inc.

Singapore . 97 parts In-Stock

1+ parts

$11.560

100+ parts

-

1k+ parts

-

10k+ parts

-

97

$11.560

-

-

-

Corphita

USA . 2,880 parts In-Stock

1+ parts

$12.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

$12.240

-

-

-

Corohmni

South Africa . 281 parts In-Stock

1+ parts

$13.600

100+ parts

-

1k+ parts

-

10k+ parts

-

281

$13.600

-

-

-

Component Stockers USA

USA . 2,191 parts In-Stock

1+ parts

$18.490

100+ parts

-

1k+ parts

-

10k+ parts

-

2,191

$18.490

-

-

-

Microchip USA

USA . 1,824 parts In-Stock

1+ parts

$51.210

100+ parts

$50.480

1k+ parts

$50.120

10k+ parts

$49.750

1,824

$51.210

$50.480

$50.120

$49.750

Northwest PG Solutions

USA . 331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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331

-

-

-

-

Native Components

USA . 313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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313

-

-

-

-

Overview

Enhance your power management system with the BQ3050DBT by Texas Instruments, a top-quality Power Management IC designed to optimize performance and efficiency. With Texas Instrument's reputation for excellence in manufacturing, this product offers reliable and durable solutions for various applications in the industry. From industrial settings to consumer electronics, the BQ3050DBT provides unparalleled value, benefits, and advantages to customers seeking cutting-edge technology for their power management needs. Upgrade your systems today with the BQ3050DBT and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 14.4 V

Optimal supply voltage for efficient power management and performance.

No. of Terminals: 38

Sufficient number of terminals for connecting various components and ensuring proper functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows the product to be used in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Width (mm): 4.4 mm

Compact width saves space on the PCB and allows for efficient board layout.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Power supply management circuit ensures stable and efficient power distribution throughout the system.

Minimum Supply Voltage (Vsup): 3.8 V

Low minimum supply voltage for compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade suitable for harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and secure connection to the PCB.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 ensures the product can withstand standard moisture exposure during handling and reflow soldering.

Maximum Supply Voltage (Vsup): 25 V

High maximum supply voltage provides flexibility in power input options.

Technical Specifications

Power Management ICs BQ3050DBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3.8 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ3050DBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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