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BQ30Z554DBTR-R1

Texas Instruments

BQ30Z554DBTR-R1 by Texas Instruments

BQ30Z554DBTR-R1 by Texas Instruments is a Power Management IC with 30 terminals, operating from -40 to 85°C. It has a supply voltage range of 3.8V to 25V and features adjustable threshold levels. This IC is ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

$12.603

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,262 parts In-Stock

1+ parts

$12.603

100+ parts

$11.008

1k+ parts

$7.592

10k+ parts

-

15,262

$12.603

$11.008

$7.592

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,290 parts In-Stock

1+ parts

$11.973

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-

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4,290

$11.973

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Vyrian

USA . 5,736 parts In-Stock

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5,736

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Distributors (Availability)

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AZTECH Wire

Italy . 1,177 parts In-Stock

1+ parts

$10.080

100+ parts

-

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1,177

$10.080

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Ampacity Inc.

Singapore . 15,159 parts In-Stock

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$10.710

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$10.710

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Semicontronic

India . 14,868 parts In-Stock

1+ parts

$10.710

100+ parts

$10.442

1k+ parts

$10.389

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14,868

$10.710

$10.442

$10.389

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Corphita

USA . 1,542 parts In-Stock

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$11.343

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1,542

$11.343

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Parana Technologies

USA . 119 parts In-Stock

1+ parts

$11.806

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-

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$12.206

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119

$11.806

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$12.206

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Corohmni

South Africa . 305 parts In-Stock

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$12.603

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305

$12.603

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DigiPath Technology Company

USA . 2,352 parts In-Stock

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$13.000

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2,352

$13.000

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ChromeModa Solutions

Germany . 2,026 parts In-Stock

1+ parts

$13.265

100+ parts

$10.877

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2,026

$13.265

$10.877

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IDEA Electronic Components Group

UK . 408 parts In-Stock

1+ parts

$13.265

100+ parts

$12.602

1k+ parts

$11.938

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408

$13.265

$12.602

$11.938

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Native Components

USA . 434 parts In-Stock

1+ parts

$30.380

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$29.165

434

$30.380

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$29.165

Northwest PG Solutions

USA . 1,942 parts In-Stock

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$33.418

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QUARKTWIN TECHNOLOGY LTD

USA . 29,560 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,496 parts In-Stock

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Epart123

USA . 6,000 parts In-Stock

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$4.200

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$4.200

6,000

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$4.200

Alle Elektronik GmbH

Germany . 4,065 parts In-Stock

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Metaverse IC Inc.

Canada . 1,398 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Lixinc

USA . 775 parts In-Stock

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775

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Overview

Texas Instruments, a trusted name in the industry, brings you the BQ30Z554DBTR-R1 Power Management IC. Designed with precision and reliability in mind, this IC is perfect for a wide range of applications. From maximizing battery life to ensuring efficient power management, this product delivers unparalleled performance. With Texas Instruments' reputation for quality and innovation, you can trust that the BQ30Z554DBTR-R1 will provide exceptional value and benefits for all your power management needs. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good thermal performance and durability, making the product suitable for a wide range of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic assemblies, reducing overall assembly time and cost.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of board space and allows for easy placement on PCBs.

Nominal Supply Voltage (Vsup): 14.4 V

Suitable nominal supply voltage for various power management applications, ensuring compatibility with a range of systems.

No. of Terminals: 30

Having 30 terminals allows for versatile connectivity options and support for multiple functions within the power management circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width (mm): 4.4 mm

Compact width of 4.4mm enables space-saving designs and easy integration into tightly packed electronic systems.

Minimum Supply Voltage (Vsup): 3.8 V

Low minimum supply voltage allows for efficient power management even in systems with low power requirements.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating environments with varying temperature conditions.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates the product can withstand moderate exposure to moisture during storage and handling.

Maximum Supply Voltage (Vsup): 25 V

Having a maximum supply voltage of 25V allows the product to handle higher voltage inputs, offering flexibility in various applications.

Adjustable Threshold: YES

Ability to adjust thresholds makes the product versatile and adaptable to different voltage settings and requirements.

Technical Specifications

Power Management ICs BQ30Z554DBTR-R1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3.8 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ30Z554DBTR-R1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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