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BQ30Z554DBT-R1

Texas Instruments

BQ30Z554DBT-R1 by Texas Instruments

BQ30Z554DBT-R1 by Texas Instruments is a Power Management IC with 30 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 3.8V to 25V and features adjustable threshold levels. This IC is ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

$12.403

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

1+ parts

$10.010

100+ parts

$9.810

1k+ parts

$9.610

10k+ parts

-

300

$10.010

$9.810

$9.610

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Texas Instruments

USA . 2,685 parts In-Stock

1+ parts

$14.796

100+ parts

$12.924

1k+ parts

$8.913

10k+ parts

-

2,685

$14.796

$12.924

$8.913

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,134 parts In-Stock

1+ parts

$14.056

100+ parts

-

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3,134

$14.056

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Vyrian

USA . 5,649 parts In-Stock

1+ parts

-

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5,649

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,273 parts In-Stock

1+ parts

$12.580

100+ parts

$12.266

1k+ parts

$12.203

10k+ parts

-

2,273

$12.580

$12.266

$12.203

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Corphita

USA . 3,554 parts In-Stock

1+ parts

$13.316

100+ parts

-

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3,554

$13.316

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-

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AZTECH Wire

Italy . 139 parts In-Stock

1+ parts

$14.080

100+ parts

-

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139

$14.080

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-

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Corohmni

South Africa . 241 parts In-Stock

1+ parts

$14.796

100+ parts

-

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241

$14.796

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-

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Parana Technologies

USA . 1,943 parts In-Stock

1+ parts

$19.262

100+ parts

-

1k+ parts

$19.294

10k+ parts

-

1,943

$19.262

-

$19.294

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DigiPath Technology Company

USA . 1,436 parts In-Stock

1+ parts

$21.210

100+ parts

-

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1,436

$21.210

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IDEA Electronic Components Group

UK . 1,363 parts In-Stock

1+ parts

$21.643

100+ parts

$20.561

1k+ parts

$19.479

10k+ parts

-

1,363

$21.643

$20.561

$19.479

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ChromeModa Solutions

Germany . 492 parts In-Stock

1+ parts

$21.643

100+ parts

$17.747

1k+ parts

-

10k+ parts

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492

$21.643

$17.747

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Microchip USA

USA . 1,637 parts In-Stock

1+ parts

$46.630

100+ parts

$45.970

1k+ parts

$45.630

10k+ parts

$45.300

1,637

$46.630

$45.970

$45.630

$45.300

Northwest PG Solutions

USA . 1,285 parts In-Stock

1+ parts

-

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1,285

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Native Components

USA . 814 parts In-Stock

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814

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Perfect Parts

USA . 101 parts In-Stock

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101

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Overview

Discover the cutting-edge BQ30Z554DBT-R1 by Texas Instruments, a top-quality Power Management IC that brings unparalleled efficiency and reliability to your projects. Crafted by the renowned manufacturer Texas Instruments, this innovative IC offers a wide range of applications in power supply management circuits. With a robust package body material and surface mount capability, this product stands out for its exceptional performance in industrial environments. Experience the value and benefits of the BQ30Z554DBT-R1, from its adjustable threshold to its maximum supply voltage of 25V, making it the perfect choice for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Nominal Supply Voltage (Vsup): 14.4 V

The nominal supply voltage of 14.4 V makes it suitable for a wide range of applications.

No. of Terminals: 30

With 30 terminals, this power management IC offers versatility and flexibility in connectivity.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance.

Width (mm): 4.4 mm

The compact width of 4.4 mm saves space on the PCB.

Minimum Supply Voltage (Vsup): 3.8 V

The minimum supply voltage of 3.8 V allows for operation in low-power scenarios.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments.

Moisture Sensitivity Level (MSL): 2

With an MSL level of 2, this product is suitable for reflow soldering processes.

Technical Specifications

Power Management ICs BQ30Z554DBT-R1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3.8 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ30Z554DBT-R1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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