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BQ3055DBTR

Texas Instruments

BQ3055DBTR by Texas Instruments

BQ3055DBTR by Texas Instruments is a Power Management IC with 30 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 3.8V to 25V and is suitable for industrial applications requiring power supply management circuits in compact spaces. The package style is small outline, thin profile, shrink pitch, making it ideal for surface mount designs.

Median Price

$12.176

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23,945 parts In-Stock

1+ parts

$12.603

100+ parts

$11.008

1k+ parts

$7.592

10k+ parts

-

23,945

$12.603

$11.008

$7.592

-

Rochester

USA . 153,928 parts In-Stock

1+ parts

-

100+ parts

$9.490

1k+ parts

$8.490

10k+ parts

$7.990

153,928

-

$9.490

$8.490

$7.990

DigiKey

USA . 153,928 parts In-Stock

1+ parts

-

100+ parts

$12.490

1k+ parts

-

10k+ parts

-

153,928

-

$12.490

-

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Verical

USA . 153,928 parts In-Stock

1+ parts

-

100+ parts

$11.863

1k+ parts

$10.613

10k+ parts

$9.988

153,928

-

$11.863

$10.613

$9.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,680 parts In-Stock

1+ parts

$10.013

100+ parts

-

1k+ parts

-

10k+ parts

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1,680

$10.013

-

-

-

Vyrian

USA . 3,794 parts In-Stock

1+ parts

$10.540

100+ parts

-

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-

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3,794

$10.540

-

-

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DigiKey Marketplace

USA . 153,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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153,928

-

-

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Bristol Electronics

USA . 8,000 parts In-Stock

1+ parts

-

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8,000

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Cogito LLC

Ukraine . 10 parts In-Stock

1+ parts

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-

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10

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 242 parts In-Stock

1+ parts

$9.486

100+ parts

-

1k+ parts

-

10k+ parts

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242

$9.486

-

-

-

Component Stockers USA

USA . 123,144 parts In-Stock

1+ parts

$10.900

100+ parts

$10.250

1k+ parts

$8.220

10k+ parts

$8.220

123,144

$10.900

$10.250

$8.220

$8.220

Parana Technologies

USA . 1,665 parts In-Stock

1+ parts

$13.630

100+ parts

-

1k+ parts

$14.130

10k+ parts

-

1,665

$13.630

-

$14.130

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$13.732

100+ parts

-

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40

$13.732

-

-

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DigiPath Technology Company

USA . 1,081 parts In-Stock

1+ parts

$15.009

100+ parts

-

1k+ parts

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10k+ parts

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1,081

$15.009

-

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ChromeModa Solutions

Germany . 6,414 parts In-Stock

1+ parts

$15.315

100+ parts

$12.558

1k+ parts

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6,414

$15.315

$12.558

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IDEA Electronic Components Group

UK . 1,503 parts In-Stock

1+ parts

$15.315

100+ parts

$14.549

1k+ parts

$13.784

10k+ parts

-

1,503

$15.315

$14.549

$13.784

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$16.796

100+ parts

$15.284

1k+ parts

$13.773

10k+ parts

-

500

$16.796

$15.284

$13.773

-

Microchip USA

USA . 2,265 parts In-Stock

1+ parts

$27.480

100+ parts

$27.090

1k+ parts

$26.890

10k+ parts

$26.700

2,265

$27.480

$27.090

$26.890

$26.700

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 15,292 parts In-Stock

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15,292

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QUARKTWIN TECHNOLOGY LTD

USA . 12,685 parts In-Stock

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12,685

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Perfect Parts

USA . 8,113 parts In-Stock

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8,113

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A-Z Elektronik GmbH

Germany . 6,542 parts In-Stock

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6,542

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Alle Elektronik GmbH

Germany . 4,361 parts In-Stock

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4,361

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Northwest PG Solutions

USA . 1,655 parts In-Stock

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1,655

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Native Components

USA . 30 parts In-Stock

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30

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Overview

Enhance your power management systems with the BQ3055DBTR by Texas Instruments, a high-quality Power Management IC designed to optimize performance and efficiency. Manufactured by industry leader Texas Instruments, this versatile component is ideal for a wide range of applications in various industries. With its small outline, thin profile, and dual terminal position, this IC offers unmatched reliability and precision. Experience seamless integration and enhanced functionality with the BQ3055DBTR, setting a new standard for power supply management circuits. Unlock the potential of your systems with this top-tier solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for housing the power management IC, ensuring reliability and affordability.

Surface Mount: YES

Ease of installation on circuit boards, making it suitable for automated manufacturing processes.

Nominal Supply Voltage (Vsup): 14.4 V

Suitable for applications requiring a stable supply voltage within this range.

No. of Terminals: 30

Provides flexibility in connecting various components and peripherals to the power management IC.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Width (mm): 4.4 mm

Compact size allows for space-efficient design and integration into electronic devices.

No. of Channels: 4

Offers multiple channels for managing power distribution efficiently in complex systems.

Maximum Supply Voltage (Vsup): 25 V

Can handle a higher supply voltage, providing flexibility for a wider range of applications.

Technical Specifications

Power Management ICs BQ3055DBTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3.8 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ3055DBTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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