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BQ25887RGET

Texas Instruments

BQ25887RGET by Texas Instruments

BQ25887RGET by Texas Instruments is a Power Management IC with 24 terminals, operating b/w -40 to 85°C. It has a boost switcher config, supports supply voltage range of 3.9V to 6.2V, and comes in a square chip carrier package suitable for industrial applications.

Median Price

$5.890

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 37,750 parts In-Stock

1+ parts

$4.523

100+ parts

$3.687

1k+ parts

$2.458

10k+ parts

-

37,750

$4.523

$3.687

$2.458

-

DigiKey

USA . 235 parts In-Stock

1+ parts

$5.890

100+ parts

$3.794

1k+ parts

$3.450

10k+ parts

$3.320

235

$5.890

$3.794

$3.450

$3.320

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$5.890

100+ parts

$3.800

1k+ parts

$3.350

10k+ parts

-

141

$5.890

$3.800

$3.350

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$3.780

-

-

-

Digiode

USA . 1,444 parts In-Stock

1+ parts

$4.297

100+ parts

-

1k+ parts

-

10k+ parts

-

1,444

$4.297

-

-

-

Vyrian

USA . 8,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,881

-

-

-

-

VNN

France . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,631 parts In-Stock

1+ parts

$2.610

100+ parts

-

1k+ parts

-

10k+ parts

-

12,631

$2.610

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.704

100+ parts

-

1k+ parts

$3.556

10k+ parts

-

2,000

$3.704

-

$3.556

-

Argo Parts USA

USA . 4,320 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

4,320

$3.780

-

-

-

Continental Prestige Electronics

USA . 5 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

$3.704

5

$3.780

-

-

$3.704

Corphita

USA . 684 parts In-Stock

1+ parts

$4.071

100+ parts

-

1k+ parts

-

10k+ parts

-

684

$4.071

-

-

-

Corohmni

South Africa . 1,027 parts In-Stock

1+ parts

$6.744

100+ parts

-

1k+ parts

-

10k+ parts

-

1,027

$6.744

-

-

-

Parana Technologies

USA . 262 parts In-Stock

1+ parts

$15.280

100+ parts

-

1k+ parts

$15.675

10k+ parts

-

262

$15.280

-

$15.675

-

DigiPath Technology Company

USA . 260 parts In-Stock

1+ parts

$16.825

100+ parts

$15.479

1k+ parts

-

10k+ parts

-

260

$16.825

$15.479

-

-

IDEA Electronic Components Group

UK . 1,605 parts In-Stock

1+ parts

$17.168

100+ parts

$16.310

1k+ parts

$15.451

10k+ parts

-

1,605

$17.168

$16.310

$15.451

-

ChromeModa Solutions

Germany . 1,540 parts In-Stock

1+ parts

$17.168

100+ parts

$14.078

1k+ parts

-

10k+ parts

-

1,540

$17.168

$14.078

-

-

Overview

Enhance your power management system with the BQ25887RGET by Texas Instruments. Known for their top-quality products, Texas Instruments offers a cutting-edge Power Management IC that is ideal for a variety of applications. With its sleek design and advanced features, this IC provides reliable performance and efficiency. Upgrade your electronics with the BQ25887RGET and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in power management ICs for its durability and heat resistance, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and efficient use of space on a circuit board, making this product suitable for compact designs.

Nominal Supply Voltage (Vsup): 5 V

5V is a common operating voltage for many electronic devices, making this power management IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this power management IC can withstand high temperatures, making it suitable for industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance and longevity of the product.

Minimum Supply Voltage (Vsup): 3.9 V

The minimum supply voltage of 3.9V allows for flexibility in powering the IC, making it suitable for low-power applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial use means this power management IC is designed to meet stringent requirements for reliability and durability in harsh operating conditions.

Technical Specifications

Power Management ICs BQ25887RGET attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6.2 V

Minimum Supply Voltage (Vsup):

3.9 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BOOST

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ25887RGET Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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