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BQ25600DYFFT

Texas Instruments

BQ25600DYFFT by Texas Instruments

BQ25600DYFFT by Texas Instruments is a Power Management IC with 30 terminals, operating voltage range of 3.9V to 13.5V, and peak reflow temperature of 260°C. It features a BUCK switcher configuration and is ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

$3.840

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,250 parts In-Stock

1+ parts

$3.083

100+ parts

$2.701

1k+ parts

$1.526

10k+ parts

-

1,250

$3.083

$2.701

$1.526

-

DigiKey

USA . 623 parts In-Stock

1+ parts

$3.840

100+ parts

$2.405

1k+ parts

$2.144

10k+ parts

$2.056

623

$3.840

$2.405

$2.144

$2.056

Mouser Electronics

USA . 273 parts In-Stock

1+ parts

$3.840

100+ parts

$2.410

1k+ parts

$2.070

10k+ parts

$2.050

273

$3.840

$2.410

$2.070

$2.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,218 parts In-Stock

1+ parts

$2.929

100+ parts

-

1k+ parts

-

10k+ parts

-

4,218

$2.929

-

-

-

Vyrian

USA . 6,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,616

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 594 parts In-Stock

1+ parts

$0.255

100+ parts

-

1k+ parts

-

10k+ parts

$0.245

594

$0.255

-

-

$0.245

Northwest PG Solutions

USA . 1,099 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

-

10k+ parts

$0.247

1,099

$0.280

-

-

$0.247

Component Stockers USA

USA . 2,626 parts In-Stock

1+ parts

$0.820

100+ parts

$2.900

1k+ parts

$1.620

10k+ parts

-

2,626

$0.820

$2.900

$1.620

-

Ampacity Inc.

Singapore . 410 parts In-Stock

1+ parts

$2.620

100+ parts

-

1k+ parts

-

10k+ parts

-

410

$2.620

-

-

-

Semicontronic

India . 293 parts In-Stock

1+ parts

$2.620

100+ parts

$2.554

1k+ parts

$2.541

10k+ parts

-

293

$2.620

$2.554

$2.541

-

Corphita

USA . 1,478 parts In-Stock

1+ parts

$2.775

100+ parts

-

1k+ parts

-

10k+ parts

-

1,478

$2.775

-

-

-

Corohmni

South Africa . 321 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$3.010

-

-

-

Parana Technologies

USA . 1,755 parts In-Stock

1+ parts

$8.724

100+ parts

-

1k+ parts

$9.405

10k+ parts

-

1,755

$8.724

-

$9.405

-

ChromeModa Solutions

Germany . 1,308 parts In-Stock

1+ parts

$9.802

100+ parts

$8.038

1k+ parts

-

10k+ parts

-

1,308

$9.802

$8.038

-

-

IDEA Electronic Components Group

UK . 922 parts In-Stock

1+ parts

$9.802

100+ parts

$9.312

1k+ parts

$8.822

10k+ parts

-

922

$9.802

$9.312

$8.822

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

DigiPath Technology Company

USA . 458 parts In-Stock

1+ parts

-

100+ parts

$8.837

1k+ parts

-

10k+ parts

-

458

-

$8.837

-

-

Overview

Unlock the power of efficient and reliable charging with the BQ25600DYFFT by Texas Instruments. As a leading manufacturer in Power Management ICs, Texas Instruments delivers top-notch quality and performance. This versatile IC is perfect for a wide range of applications, offering customers unparalleled value and benefits. Say goodbye to slow charging times and hello to optimized power management with the BQ25600DYFFT.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort in the assembly process.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor for compatibility with various PCB layouts and designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage ensures compatibility with a wide range of electronic devices and systems.

No. of Terminals: 30

Having 30 terminals allows for multiple connections and functions within the power management IC, enhancing its versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch design helps in achieving high packaging density, saving space on the PCB.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this power management IC can withstand demanding operating conditions without any performance issues.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme temperature environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom simplifies the PCB layout and assembly process.

Maximum Seated Height: 0.625 mm

The low seated height of 0.625mm allows for a compact design with minimal space requirements.

Width (mm): 1.9615 mm

The narrow width of 1.9615mm enables easy integration into space-constrained applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC provides efficient control and regulation of power delivery to ensure optimal performance and reliability.

Minimum Supply Voltage (Vsup): 3.9 V

The low minimum supply voltage of 3.9V allows for operation in low-power applications without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the IC can be effectively soldered onto the PCB without heat-related damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and bonding of the IC during the manufacturing process.

Length: 2.362 mm

The compact length of 2.362mm contributes to a small overall footprint, making this IC suitable for miniaturized electronic devices.

Nominal Threshold Voltage (V): +0.265V

The nominal threshold voltage of +0.265V helps in precise voltage regulation and control, ensuring stable power delivery.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade makes this IC suitable for rugged applications requiring reliable performance in harsh environments.

Maximum Supply Current (Isup): 3 mA

With a maximum supply current of 3mA, this IC operates efficiently while consuming minimal power, making it energy-efficient.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates high-density mounting on the PCB.

Switcher Config: BUCK

The buck switcher configuration offers efficient voltage conversion and regulation, enhancing the overall power management capabilities of the IC.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for compact integration and high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 13.5 V

The high maximum supply voltage of 13.5V provides compatibility with a wide range of power sources and systems, increasing flexibility in usage.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization and fine-tuning of voltage regulation parameters to meet specific application requirements.

Technical Specifications

Power Management ICs BQ25600DYFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e1

Length:

2.362 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

3.9 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.265V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.9615 mm

Trade Compliance

BQ25600DYFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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