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BQ25101YFPT

Texas Instruments

BQ25101YFPT by Texas Instruments

BQ25101YFPT by Texas Instruments is a Power Management IC with a rectangular package style, very thin profile, and fine pitch. It operates b/w 0-125°C, supports power supply circuits with Vsup ranging from 4.45V to 6.45V. Ideal for applications requiring compact design and efficient power management in electronic devices.

Median Price

$1.831

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$0.196

-

-

-

Texas Instruments

USA . 3,929 parts In-Stock

1+ parts

$1.602

100+ parts

$1.323

1k+ parts

$0.715

10k+ parts

-

3,929

$1.602

$1.323

$0.715

-

Mouser Electronics

USA . 188 parts In-Stock

1+ parts

$2.060

100+ parts

$1.240

1k+ parts

$1.120

10k+ parts

$1.070

188

$2.060

$1.240

$1.120

$1.070

DigiKey

USA . 187 parts In-Stock

1+ parts

$2.060

100+ parts

$1.239

1k+ parts

$1.125

10k+ parts

-

187

$2.060

$1.239

$1.125

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,008 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

-

10k+ parts

-

4,008

$0.186

-

-

-

Chip Stock

USA . 51,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

51,502

-

-

-

-

Vyrian

USA . 3,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,056

-

-

-

-

Prism Electronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

490

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,298 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

2,298

$0.176

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.890

100+ parts

$1.871

1k+ parts

$1.795

10k+ parts

-

100

$1.890

$1.871

$1.795

-

Parana Technologies

USA . 1,775 parts In-Stock

1+ parts

$11.600

100+ parts

$1,077.260

1k+ parts

$10.440

10k+ parts

-

1,775

$11.600

$1,077.260

$10.440

-

DigiPath Technology Company

USA . 727 parts In-Stock

1+ parts

$12.773

100+ parts

$11.751

1k+ parts

-

10k+ parts

-

727

$12.773

$11.751

-

-

Native Components

USA . 54 parts In-Stock

1+ parts

$12.916

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$12.916

-

-

-

ChromeModa Solutions

Germany . 6,575 parts In-Stock

1+ parts

$13.034

100+ parts

$10.688

1k+ parts

-

10k+ parts

-

6,575

$13.034

$10.688

-

-

IDEA Electronic Components Group

UK . 349 parts In-Stock

1+ parts

$13.034

100+ parts

$12.382

1k+ parts

$11.731

10k+ parts

-

349

$13.034

$12.382

$11.731

-

Northwest PG Solutions

USA . 1,106 parts In-Stock

1+ parts

$14.208

100+ parts

$12.787

1k+ parts

-

10k+ parts

-

1,106

$14.208

$12.787

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-

Microchip USA

USA . 12,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,359

-

-

-

-

Futuretech Components

Singapore . 280 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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280

-

-

-

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Kepictronics

USA . 224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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224

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Overview

Elevate your power management capabilities with the BQ25101YFPT by Texas Instruments. This cutting-edge Power Management IC boasts top-notch quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this product offers unmatched value with its sleek design and high performance. Experience the benefits of efficiency, durability, and precision with the BQ25101YFPT - the ultimate solution for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and organized layout for components, optimizing space usage on the PCB.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in various temperature environments without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin silver copper offers good solderability and electrical conductivity, enhancing the product's reliability.

Width (mm): 1.4 mm

Narrow width of 1.4 mm enables the product to fit into tight spaces on the PCB, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 4.45 V

Low minimum supply voltage of 4.45 V allows for compatibility with a wide range of power sources, making it versatile for various applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust solder joints during the assembly process, leading to reliable connection.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm facilitates high-density mounting on the PCB, enabling efficient use of board space.

Maximum Supply Voltage (Vsup): 6.45 V

High maximum supply voltage of 6.45 V allows for operation with a wide range of power sources, increasing the product's versatility.

Technical Specifications

Power Management ICs BQ25101YFPT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

6.45 V

Minimum Supply Voltage (Vsup):

4.45 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.4 mm

Trade Compliance

BQ25101YFPT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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