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BQ25100HYFPR

Texas Instruments

BQ25100HYFPR by Texas Instruments

BQ25100HYFPR by Texas Instruments is a Power Management IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates b/w 0-125°C and supports a min supply voltage of 4.45V for power supply applications requiring precise control in compact designs.

Median Price

$1.644

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 64,360 parts In-Stock

1+ parts

$1.317

100+ parts

$1.088

1k+ parts

$0.588

10k+ parts

-

64,360

$1.317

$1.088

$0.588

-

Mouser Electronics

USA . 419 parts In-Stock

1+ parts

$1.970

100+ parts

$1.680

1k+ parts

$1.180

10k+ parts

$0.914

419

$1.970

$1.680

$1.180

$0.914

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,176 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

-

10k+ parts

-

3,176

$1.251

-

-

-

Chip Stock

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,500

-

-

-

-

Vyrian

USA . 5,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,522

-

-

-

-

Bristol Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 391 parts In-Stock

1+ parts

$0.337

100+ parts

-

1k+ parts

-

10k+ parts

$0.324

391

$0.337

-

-

$0.324

Northwest PG Solutions

USA . 435 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

10k+ parts

$0.327

435

$0.371

-

-

$0.327

Ampacity Inc.

Singapore . 32,503 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

-

10k+ parts

-

32,503

$0.630

-

-

-

Semicontronic

India . 32,461 parts In-Stock

1+ parts

$0.630

100+ parts

$0.614

1k+ parts

$0.611

10k+ parts

-

32,461

$0.630

$0.614

$0.611

-

Corohmni

South Africa . 450 parts In-Stock

1+ parts

$0.742

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$0.742

-

-

-

Corphita

USA . 4,164 parts In-Stock

1+ parts

$1.185

100+ parts

-

1k+ parts

-

10k+ parts

-

4,164

$1.185

-

-

-

Component Stockers USA

USA . 4,599 parts In-Stock

1+ parts

$1.700

100+ parts

$1.220

1k+ parts

$0.840

10k+ parts

-

4,599

$1.700

$1.220

$0.840

-

Parana Technologies

USA . 2,169 parts In-Stock

1+ parts

$3.298

100+ parts

-

1k+ parts

$3.822

10k+ parts

-

2,169

$3.298

-

$3.822

-

DigiPath Technology Company

USA . 1,268 parts In-Stock

1+ parts

$3.632

100+ parts

-

1k+ parts

-

10k+ parts

-

1,268

$3.632

-

-

-

ChromeModa Solutions

Germany . 1,384 parts In-Stock

1+ parts

$3.706

100+ parts

$3.039

1k+ parts

-

10k+ parts

-

1,384

$3.706

$3.039

-

-

IDEA Electronic Components Group

UK . 1,244 parts In-Stock

1+ parts

$3.706

100+ parts

-

1k+ parts

$3.335

10k+ parts

-

1,244

$3.706

-

$3.335

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,761

-

-

-

-

Kepictronics

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,380

-

-

-

-

Authorized Procurement Solutions

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Overview

Elevate your power management solutions with the BQ25100HYFPR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are surface mountable and feature a grid array package style with a very thin profile. Ideal for a wide range of applications, this Power Supply Support Circuit offers unmatched reliability and efficiency. Upgrade your systems with the BQ25100HYFPR and experience the superior performance and value that Texas Instruments products are known for.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto a PCB, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient placement and stacking of components on the PCB, optimizing board space.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch enhances thermal performance and reliability, ideal for power management applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and robust performance in various operating conditions.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for use in different environmental conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

Triple terminal finish of tin, silver, and copper enhances solderability, conductivity, and durability for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and connection, enabling easier assembly and maintenance.

Maximum Seated Height: 0.5 mm

Low maximum seated height minimizes board space requirements and enables compact designs in power management applications.

Width (mm): 1.4 mm

Narrow width facilitates dense component placement, contributing to space-efficient PCB layouts and smaller form factors.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed as a power supply support circuit, offering optimized performance and functionality for power management tasks.

Minimum Supply Voltage (Vsup): 4.45 V

Low minimum supply voltage requirement allows for operation in a wide range of power supply configurations, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and component alignment during manufacturing, reducing defects.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables reliable soldering and robust connections for long-lasting performance.

Length: 1 mm

Compact length minimizes space requirements on the PCB, contributing to space-efficient designs in power management applications.

Terminal Form: BALL

Ball terminal form facilitates easy rework and repair processes, ensuring flexibility and convenience in assembly and maintenance.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for precise component placement and soldering, enhancing reliability and performance in power management circuits.

Maximum Supply Voltage (Vsup): 6.45 V

High maximum supply voltage capability supports a wide range of power sources, making the product suitable for diverse applications.

Technical Specifications

Power Management ICs BQ25100HYFPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

6.45 V

Minimum Supply Voltage (Vsup):

4.45 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.4 mm

Trade Compliance

BQ25100HYFPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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