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BQ24081DRCRG4

Texas Instruments

BQ24081DRCRG4 by Texas Instruments

BQ24081DRCRG4 by Texas Instruments is a Power Management IC with 10 terminals in a small outline package. It operates b/w -40 to 85°C, supporting supply voltage from 4.5V to 6.5V with a max current of 2mA. Ideal for industrial applications requiring efficient power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,714 parts In-Stock

1+ parts

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4,714

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Vyrian

USA . 3,362 parts In-Stock

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3,362

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 792 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

792

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 1,583 parts In-Stock

1+ parts

$6.500

100+ parts

-

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1,583

$6.500

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Parana Technologies

USA . 2,075 parts In-Stock

1+ parts

$10.698

100+ parts

-

1k+ parts

$11.185

10k+ parts

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2,075

$10.698

-

$11.185

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DigiPath Technology Company

USA . 1,809 parts In-Stock

1+ parts

$11.780

100+ parts

-

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1,809

$11.780

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AZTECH Wire

Italy . 497 parts In-Stock

1+ parts

$11.929

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497

$11.929

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ChromeModa Solutions

Germany . 6,348 parts In-Stock

1+ parts

$12.020

100+ parts

$9.856

1k+ parts

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6,348

$12.020

$9.856

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IDEA Electronic Components Group

UK . 1,973 parts In-Stock

1+ parts

$12.020

100+ parts

$11.419

1k+ parts

$10.818

10k+ parts

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1,973

$12.020

$11.419

$10.818

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Native Components

USA . 670 parts In-Stock

1+ parts

$69.674

100+ parts

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$66.887

670

$69.674

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$66.887

Northwest PG Solutions

USA . 1,179 parts In-Stock

1+ parts

$76.641

100+ parts

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1,179

$76.641

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Corphita

USA . 3,072 parts In-Stock

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3,072

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Microchip USA

USA . 2,293 parts In-Stock

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2,293

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Corohmni

South Africa . 112 parts In-Stock

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112

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Futuretech Components

Singapore . 100 parts In-Stock

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100

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Enhance your power management solutions with the BQ24081DRCRG4 by Texas Instruments, a top-tier manufacturer renowned for its quality and reliability. This Power Management IC offers unparalleled performance in a compact package, making it ideal for a wide range of applications. From industrial settings to consumer electronics, this versatile product ensures optimal power supply support with efficiency and precision. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the BQ24081DRCRG4 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the product reliable and easy to handle.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits, saving time and cost.

Package Shape: SQUARE

Square shape provides a compact design, saving space on the PCB.

No. of Terminals: 10

Sufficient number of terminals for connecting various external components and devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline, heat sink/slug, and very thin profile design help in heat dissipation and space-saving on the PCB.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature allows usage in both cold and hot conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold terminal finish ensures good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position enables flexibility in circuit connection and layout.

Maximum Seated Height: 1 mm

Low seated height saves space and enables compact design in electronic applications.

Width (mm): 3 mm

Narrow width allows for better integration and space-saving on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit enhances the reliability and stability of the power management system.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement enables operation in lower power scenarios.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and robust assembly during manufacturing process.

Length: 3 mm

Small length dimension contributes to the compact and space-saving design of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability and durability in harsh operating conditions.

Maximum Supply Current (Isup): 2 mA

Low maximum supply current requirement indicates energy efficiency and lower power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces hazardous materials.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density mounting and more compact PCB layout.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Maximum Supply Voltage (Vsup): 6.5 V

High maximum supply voltage capability ensures compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs BQ24081DRCRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

2 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ24081DRCRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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