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BBN6203BGNY30C

Texas Instruments

BBN6203BGNY30C by Texas Instruments

BBN6203BGNY30C by Texas Instruments is a DSP with 32-bit external data bus width, 20-bit address bus width, and operates at 1.43-1.57V. Ideal for applications requiring low power mode, it features a grid array package style and CMOS technology for digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,514 parts In-Stock

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7,514

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Digiode

USA . 554 parts In-Stock

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554

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VNN

France . 90 parts In-Stock

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90

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Nova Conductors

Japan . 81 parts In-Stock

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81

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Distributors (Availability)

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One Stop Electronics

USA . 958 parts In-Stock

1+ parts

$1.000

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958

$1.000

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Ampacity Inc.

Singapore . 579 parts In-Stock

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$3.000

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579

$3.000

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Parana Technologies

USA . 169 parts In-Stock

1+ parts

$16.275

100+ parts

$1,511.421

1k+ parts

$14.648

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169

$16.275

$1,511.421

$14.648

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DigiPath Technology Company

USA . 1,346 parts In-Stock

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$17.921

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$17.921

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IDEA Electronic Components Group

UK . 1,859 parts In-Stock

1+ parts

$18.287

100+ parts

$17.373

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$16.458

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1,859

$18.287

$17.373

$16.458

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ChromeModa Solutions

Germany . 1,566 parts In-Stock

1+ parts

$18.287

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$14.995

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1,566

$18.287

$14.995

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AZTECH Wire

Italy . 360 parts In-Stock

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$19.419

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360

$19.419

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Semicontronic

India . 1,365 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

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$25.220

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1,365

$26.000

$25.350

$25.220

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Microchip USA

USA . 1,557 parts In-Stock

1+ parts

$120.800

100+ parts

$117.580

1k+ parts

$115.970

10k+ parts

$114.350

1,557

$120.800

$117.580

$115.970

$114.350

Corohmni

South Africa . 1,027 parts In-Stock

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$131.480

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1,027

$131.480

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Argo Parts USA

USA . 4,297 parts In-Stock

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Continental Prestige Electronics

USA . 3,959 parts In-Stock

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Corphita

USA . 113 parts In-Stock

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113

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Experience top-of-the-line performance with the BBN6203BGNY30C from Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) offers unparalleled processing power for a wide range of applications, ensuring optimized efficiency and reliability. With its advanced features, high-quality construction, and versatile capabilities, this product provides exceptional value and benefits to customers looking for cutting-edge technology. Elevate your projects with the BBN6203BGNY30C and unlock a new world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 1.57 V

Allows for reliable and stable operation within the specified voltage range, ensuring consistent performance.

Address Bus Width: 20

Enhances the processing capabilities of the DSP, enabling efficient handling of memory addresses and data.

Package Shape: SQUARE

Facilitates compact and space-saving design, ideal for applications with limited board space.

No. of Terminals: 384

Provides ample connectivity options for interfacing with other components or peripherals, increasing versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

Ensures secure connections and reliable performance, especially in high-speed and high-density applications.

Minimum Supply Voltage: 1.43 V

Allows for efficient power management and optimization, enhancing energy efficiency of the product.

Maximum Operating Temperature: 90 °C

Ensures reliable operation even in high-temperature environments, making the product suitable for industrial and automotive applications.

Minimum Operating Temperature: 0 °C

Maintains performance integrity in cold environments, enabling reliable operation in various temperature conditions.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity, ensuring secure connections during assembly and operation.

Terminal Position: BOTTOM

Facilitates easy PCB layout and integration, simplifying the assembly process and optimizing space usage.

Maximum Seated Height: 2.35 mm

Allows for low-profile designs, ideal for compact electronic devices where space is a constraint.

Width: 18 mm

Offers a compact form factor, suitable for applications where size constraints are important.

Boundary Scan: YES

Enables efficient testing and debugging of the product, ensuring quality and reliability.

External Data Bus Width: 32

Enhances data processing capabilities, enabling faster and more efficient execution of algorithms and computations.

Maximum Time At Peak Reflow Temperature (s): 20

Ensures proper soldering of the component during manufacturing, contributing to the reliability and longevity of the product.

Peak Reflow Temperature °C: 220

Compatible with standard reflow soldering processes, making it easy to integrate into existing manufacturing workflows.

Internal Bus Architecture: MULTIPLE

Optimizes data throughput and processing speed, enabling high-performance signal processing applications.

Length: 18 mm

Contributes to the compact form factor of the product, suitable for applications with space constraints.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Indicates the versatile and specialized nature of the product, tailored for specific signal processing tasks.

Technology: CMOS

Provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

Facilitates easy and reliable soldering during assembly, ensuring secure connections for stable operation.

Nominal Supply Voltage: 1.5 V

Optimizes power consumption and performance balance, ensuring efficient operation within the specified voltage range.

Terminal Pitch: 0.8 mm

Enables high-density mounting, suitable for applications requiring compact and space-saving designs.

Format: FIXED POINT

Specific signal processing format suitable for applications that require accuracy and precision in computations and data processing.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture and humidity, ensuring reliability in various environmental conditions.

Low Power Mode: YES

Enhances energy efficiency and extends battery life, making the product suitable for portable and low-power devices.

Technical Specifications

Digital Signal Processors (DSPs) BBN6203BGNY30C attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B384

JESD-609 Code:

e0

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

384

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

18 mm

Peripheral IC Type:

Trade Compliance

BBN6203BGNY30C Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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