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AMC60704YBHR

Texas Instruments

AMC60704YBHR by Texas Instruments

Texas Instruments AMC60704YBHR is a 36-terminal analog circuit IC with 4 channels. Operating b/w -40°C to 105°C, it has a supply voltage range of 1.7V to 3.6V. This surface-mount device in square package is ideal for various electronic applications requiring precise signal processing capabilities.

Median Price

$12.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,719 parts In-Stock

1+ parts

$6.856

100+ parts

$5.989

1k+ parts

$4.130

10k+ parts

-

6,719

$6.856

$5.989

$4.130

-

DigiKey

USA . 1,980 parts In-Stock

1+ parts

$12.420

100+ parts

$8.366

1k+ parts

$7.635

10k+ parts

$6.312

1,980

$12.420

$8.366

$7.635

$6.312

Mouser Electronics

USA . 1,650 parts In-Stock

1+ parts

$12.420

100+ parts

$8.370

1k+ parts

$7.010

10k+ parts

$6.300

1,650

$12.420

$8.370

$7.010

$6.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,002 parts In-Stock

1+ parts

$6.513

100+ parts

-

1k+ parts

-

10k+ parts

-

4,002

$6.513

-

-

-

Vyrian

USA . 2,031 parts In-Stock

1+ parts

$6.856

100+ parts

-

1k+ parts

-

10k+ parts

-

2,031

$6.856

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 968 parts In-Stock

1+ parts

$1.718

100+ parts

-

1k+ parts

-

10k+ parts

-

968

$1.718

-

-

-

Northwest PG Solutions

USA . 1,867 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$1.890

-

-

-

Corohmni

South Africa . 53 parts In-Stock

1+ parts

$5.210

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$5.210

-

-

-

Semicontronic

India . 3,797 parts In-Stock

1+ parts

$5.830

100+ parts

$5.684

1k+ parts

$5.655

10k+ parts

-

3,797

$5.830

$5.684

$5.655

-

Ampacity Inc.

Singapore . 3,740 parts In-Stock

1+ parts

$5.830

100+ parts

-

1k+ parts

-

10k+ parts

-

3,740

$5.830

-

-

-

Corphita

USA . 4,503 parts In-Stock

1+ parts

$6.170

100+ parts

-

1k+ parts

-

10k+ parts

-

4,503

$6.170

-

-

-

Microchip USA

USA . 2,025 parts In-Stock

1+ parts

$18.200

100+ parts

$17.940

1k+ parts

$17.810

10k+ parts

$17.680

2,025

$18.200

$17.940

$17.810

$17.680

Overview

Experience high-quality performance and reliability with the AMC60704YBHR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional products like this analog circuit, perfect for a variety of applications. With its durable plastic/epoxy package and surface mount design, this semiconductor offers customers unparalleled value and benefits. Whether you're in need of a solution for automotive, industrial, or consumer electronics, the AMC60704YBHR provides the quality and advantages you're looking for. Trust Texas Instruments to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ensuring reliability in various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto a PCB, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape provides a compact design, enabling efficient use of board space.

No. of Terminals: 36

With 36 terminals, this product offers flexibility in connectivity options for diverse circuit requirements.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in a wide range of temperature settings, making it versatile.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishes provides excellent conductivity and corrosion resistance for stable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and facilitates easy routing of traces for enhanced design flexibility.

Other IC type: ANALOG CIRCUIT

Being an analog circuit IC type, this product is ideal for applications requiring precise and continuous signal processing.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage requirement allows for operation in low-power applications, conserving energy.

Peak Reflow Temperature °C: 260

The high peak reflow temperature withstands the soldering process without compromising the integrity of the component.

No. of Channels: 4

With 4 channels, this product enables versatile signal routing and processing capabilities for multi-channel applications.

Terminal Form: BALL

The ball terminal form provides secure solder connections and reliable electrical contact for long-term performance.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance allows for operation in systems with varying voltage levels, enhancing compatibility.

Technical Specifications

Other Function Semiconductors AMC60704YBHR attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B36

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

AMC60704YBHR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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