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AMC60804YBHT

Texas Instruments

AMC60804YBHT by Texas Instruments

The Texas Instruments AMC60804YBHT is an industrial-grade analog circuit IC with 8 channels. It operates b/w -40°C to 105°C, with a supply voltage range of 1.7V to 3.6V. This square-shaped grid array package has a very thin profile and fine pitch, making it suitable for surface-mount applications in various electronic devices.

Median Price

$21.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,869 parts In-Stock

1+ parts

$16.713

100+ parts

$14.599

1k+ parts

$10.068

10k+ parts

-

2,869

$16.713

$14.599

$10.068

-

Mouser Electronics

USA . 1,818 parts In-Stock

1+ parts

$21.630

100+ parts

$15.790

1k+ parts

$14.420

10k+ parts

-

1,818

$21.630

$15.790

$14.420

-

DigiKey

USA . 52 parts In-Stock

1+ parts

$21.630

100+ parts

$16.222

1k+ parts

$14.129

10k+ parts

-

52

$21.630

$16.222

$14.129

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,062 parts In-Stock

1+ parts

$15.877

100+ parts

-

1k+ parts

-

10k+ parts

-

1,062

$15.877

-

-

-

Vyrian

USA . 1,712 parts In-Stock

1+ parts

$16.713

100+ parts

-

1k+ parts

-

10k+ parts

-

1,712

$16.713

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 470 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

-

10k+ parts

-

470

$12.580

-

-

-

Ampacity Inc.

Singapore . 1,737 parts In-Stock

1+ parts

$14.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,737

$14.210

-

-

-

Semicontronic

India . 1,334 parts In-Stock

1+ parts

$14.210

100+ parts

$13.855

1k+ parts

$13.784

10k+ parts

-

1,334

$14.210

$13.855

$13.784

-

Corphita

USA . 722 parts In-Stock

1+ parts

$15.042

100+ parts

-

1k+ parts

-

10k+ parts

-

722

$15.042

-

-

-

Parana Technologies

USA . 612 parts In-Stock

1+ parts

$19.431

100+ parts

$1,804.497

1k+ parts

$17.488

10k+ parts

-

612

$19.431

$1,804.497

$17.488

-

DigiPath Technology Company

USA . 2,309 parts In-Stock

1+ parts

$21.396

100+ parts

-

1k+ parts

-

10k+ parts

-

2,309

$21.396

-

-

-

ChromeModa Solutions

Germany . 3,695 parts In-Stock

1+ parts

$21.833

100+ parts

$17.903

1k+ parts

-

10k+ parts

-

3,695

$21.833

$17.903

-

-

IDEA Electronic Components Group

UK . 512 parts In-Stock

1+ parts

$21.833

100+ parts

$20.741

1k+ parts

$19.650

10k+ parts

-

512

$21.833

$20.741

$19.650

-

Lixinc

USA . 4,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,994

-

-

-

-

Northwest PG Solutions

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,085

-

-

-

-

Native Components

USA . 543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

543

-

-

-

-

Overview

Elevate your electronic designs with the AMC60804YBHT by Texas Instruments. This high-quality semiconductor offers unparalleled performance and reliability, thanks to its innovative design and cutting-edge technology. Perfect for a wide range of applications in the industrial sector, this product provides customers with exceptional value and benefits. Whether you're looking to enhance your analog circuits or optimize your electronic systems, the AMC60804YBHT delivers unmatched precision and efficiency. Upgrade your projects today with this superior semiconductor from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection, making the product suitable for various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and improving overall assembly processes.

No. of Terminals: 36

With a high number of terminals, this product offers flexibility in connectivity and functionality, allowing for more complex circuit designs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the product to function effectively in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish enhances conductivity and corrosion resistance, ensuring stable electrical connections.

Maximum Seated Height: 0.4 mm

The very thin profile and low seated height make the product suitable for applications where space constraints are a concern.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage requirement allows for efficient power consumption, making the product suitable for battery-operated devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions commonly found in industrial settings.

No. of Channels: 8

With multiple channels, the product offers enhanced functionality for signal processing and data transmission in complex systems.

Terminal Form: BALL

The ball terminal form provides secure connections and facilitates high-density packaging, making the product suitable for compact electronic devices.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, enhancing the product's versatility.

Technical Specifications

Other Function Semiconductors AMC60804YBHT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B36

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

AMC60804YBHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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