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AMC60304YBHT

Texas Instruments

AMC60304YBHT by Texas Instruments

The Texas Instruments AMC60304YBHT is a 36-terminal analog circuit IC with a grid array package style. It operates b/w -40°C to 125°C, making it suitable for various applications. With 4 channels and surface mount compatibility, it offers high performance in electronics design.

Median Price

$14.744

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,161 parts In-Stock

1+ parts

$13.668

100+ parts

$11.142

1k+ parts

$7.428

10k+ parts

-

8,161

$13.668

$11.142

$7.428

-

Mouser Electronics

USA . 225 parts In-Stock

1+ parts

$15.820

100+ parts

$14.510

1k+ parts

$10.150

10k+ parts

-

225

$15.820

$14.510

$10.150

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,218 parts In-Stock

1+ parts

$12.985

100+ parts

-

1k+ parts

-

10k+ parts

-

3,218

$12.985

-

-

-

Vyrian

USA . 6,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,548

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 309 parts In-Stock

1+ parts

$1.169

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$1.169

-

-

-

Northwest PG Solutions

USA . 2,004 parts In-Stock

1+ parts

$1.286

100+ parts

-

1k+ parts

-

10k+ parts

-

2,004

$1.286

-

-

-

Semicontronic

India . 4,094 parts In-Stock

1+ parts

$11.620

100+ parts

$11.330

1k+ parts

$11.271

10k+ parts

-

4,094

$11.620

$11.330

$11.271

-

Ampacity Inc.

Singapore . 3,775 parts In-Stock

1+ parts

$11.620

100+ parts

-

1k+ parts

-

10k+ parts

-

3,775

$11.620

-

-

-

Corphita

USA . 141 parts In-Stock

1+ parts

$12.301

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$12.301

-

-

-

Corohmni

South Africa . 416 parts In-Stock

1+ parts

$13.668

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$13.668

-

-

-

Parana Technologies

USA . 251 parts In-Stock

1+ parts

$19.057

100+ parts

-

1k+ parts

$19.109

10k+ parts

-

251

$19.057

-

$19.109

-

DigiPath Technology Company

USA . 728 parts In-Stock

1+ parts

$20.984

100+ parts

$19.305

1k+ parts

-

10k+ parts

-

728

$20.984

$19.305

-

-

ChromeModa Solutions

Germany . 5,476 parts In-Stock

1+ parts

$21.412

100+ parts

$17.558

1k+ parts

-

10k+ parts

-

5,476

$21.412

$17.558

-

-

IDEA Electronic Components Group

UK . 253 parts In-Stock

1+ parts

$21.412

100+ parts

$20.341

1k+ parts

$19.271

10k+ parts

-

253

$21.412

$20.341

$19.271

-

Microchip USA

USA . 1,467 parts In-Stock

1+ parts

$29.070

100+ parts

$28.660

1k+ parts

$28.450

10k+ parts

$28.240

1,467

$29.070

$28.660

$28.450

$28.240

Overview

Elevate your electronic designs with the Texas Instruments AMC60304YBHT, a premium quality analog circuit IC that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications in the field of other function semiconductors. With its surface mount capability, grid array package style, and advanced terminal finish, this IC ensures seamless integration and optimal functionality. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing value and benefits to customers seeking top-tier solutions for their projects. Experience innovation like never before with the AMC60304YBHT.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, making this product suitable for space-constrained applications.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during assembly, ensuring a reliable final product.

No. of Terminals: 36

With a high number of terminals, this product offers increased connectivity options and flexibility in circuit design.

Package Style (Meter): GRID ARRAY

Grid array package style allows for high density integration of components, leading to improved performance and efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable and stable operation even in harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, enhancing the durability and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier to integrate this product into existing systems.

Other IC type: ANALOG CIRCUIT

Analog circuit IC type offers precise and accurate signal processing, making this product suitable for applications requiring high-quality analog performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and assembly, resulting in reliable electrical connections and long-term performance.

No. of Channels: 4

Four channels provide multiple input/output options, allowing for versatile signal processing and control capabilities in the final product.

Terminal Form: BALL

Ball terminal form offers secure connections and easy soldering, ensuring a stable electrical interface in the assembled product.

Technical Specifications

Other Function Semiconductors AMC60304YBHT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XBGA-B36

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

AMC60304YBHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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