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AMC60304YBHR

Texas Instruments

AMC60304YBHR by Texas Instruments

Texas Instruments AMC60304YBHR is a 36-terminal analog circuit IC with 4 channels. It operates b/w -40°C to 125°C, featuring a grid array package style suitable for surface mount applications. The terminals are finished with tin silver copper, making it ideal for various electronic functions.

Median Price

$8.644

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 487,756 parts In-Stock

1+ parts

$7.158

100+ parts

$5.835

1k+ parts

$3.890

10k+ parts

-

487,756

$7.158

$5.835

$3.890

-

DigiKey

USA . 2,990 parts In-Stock

1+ parts

$10.130

100+ parts

$6.741

1k+ parts

$6.129

10k+ parts

$3.887

2,990

$10.130

$6.741

$6.129

$3.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,198 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,198

$6.800

-

-

-

Vyrian

USA . 3,430 parts In-Stock

1+ parts

$7.158

100+ parts

-

1k+ parts

-

10k+ parts

-

3,430

$7.158

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 245,261 parts In-Stock

1+ parts

$6.080

100+ parts

$5.928

1k+ parts

$5.898

10k+ parts

-

245,261

$6.080

$5.928

$5.898

-

Ampacity Inc.

Singapore . 244,998 parts In-Stock

1+ parts

$6.080

100+ parts

-

1k+ parts

-

10k+ parts

-

244,998

$6.080

-

-

-

Corphita

USA . 4,508 parts In-Stock

1+ parts

$6.442

100+ parts

-

1k+ parts

-

10k+ parts

-

4,508

$6.442

-

-

-

Corohmni

South Africa . 317 parts In-Stock

1+ parts

$7.158

100+ parts

-

1k+ parts

-

10k+ parts

-

317

$7.158

-

-

-

Parana Technologies

USA . 573 parts In-Stock

1+ parts

$11.113

100+ parts

-

1k+ parts

$11.570

10k+ parts

-

573

$11.113

-

$11.570

-

IDEA Electronic Components Group

UK . 418 parts In-Stock

1+ parts

$12.487

100+ parts

$11.863

1k+ parts

$11.238

10k+ parts

-

418

$12.487

$11.863

$11.238

-

ChromeModa Solutions

Germany . 72 parts In-Stock

1+ parts

$12.487

100+ parts

$10.239

1k+ parts

-

10k+ parts

-

72

$12.487

$10.239

-

-

Microchip USA

USA . 1,148 parts In-Stock

1+ parts

$17.100

100+ parts

$16.850

1k+ parts

$16.730

10k+ parts

$16.610

1,148

$17.100

$16.850

$16.730

$16.610

Northwest PG Solutions

USA . 1,474 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,474

-

-

-

-

DigiPath Technology Company

USA . 1,092 parts In-Stock

1+ parts

-

100+ parts

$11.258

1k+ parts

-

10k+ parts

-

1,092

-

$11.258

-

-

Native Components

USA . 660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

660

-

-

-

-

Overview

The Texas Instruments AMC60304YBHR is a cutting-edge semiconductor that offers unmatched quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is designed to meet the highest standards in performance and durability. Perfect for a wide range of applications in the field of analog circuits, this semiconductor boasts four channels and a compact square package shape. Customers can trust in the value and benefits that this product provides, from its exceptional temperature range to its advanced terminal finish. Elevate your projects with the Texas Instruments AMC60304YBHR and experience the advantage of top-tier semiconductor technology.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on a PCB without the need for additional mounting hardware, saving time and effort in assembly.

Package Shape: SQUARE

Square packages are more space-efficient on a PCB, allowing for better utilization of board space and potentially enabling a more compact overall design.

No. of Terminals: 36

A higher number of terminals provide more connectivity options and flexibility in the circuit design, allowing for more complex functionality to be achieved.

Package Style (Meter): GRID ARRAY

Grid array packages offer improved thermal performance and electrical characteristics, making them suitable for high-performance applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in a wide range of temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function in cold environments without any detrimental effects on performance.

Terminal Finish: TIN SILVER COPPER

The use of multiple terminal finishes enhances the product's durability and resistance to corrosion, improving its overall reliability and longevity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing, simplifying the design process and reducing the risk of signal interference.

Other IC type: ANALOG CIRCUIT

Analog circuits enable precise signal processing and conversion, making this product suitable for applications requiring accurate and high-quality analog signal handling.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly, ensuring proper soldering and reliable connections for robust device performance.

No. of Channels: 4

The presence of multiple channels allows for the processing of multiple input signals simultaneously, expanding the product's functionality and versatility.

Terminal Form: BALL

Ball terminal form provides good electrical contact and mechanical strength, making it suitable for applications requiring reliable and stable connections.

Technical Specifications

Other Function Semiconductors AMC60304YBHR attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-XBGA-B36

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

AMC60304YBHR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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