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REF200AUG4

Texas Instruments

REF200AUG4 by Texas Instruments

REF200AUG4 by Texas Instruments is a dual-function analog circuit in a small outline package. With a nominal voltage of 15V, it operates b/w -25°C to 85°C. Suitable for various applications requiring precise voltage references and temperature stability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,456 parts In-Stock

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8,456

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Digiode

USA . 4,759 parts In-Stock

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4,759

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Semicontronic

India . 1,060 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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1,060

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 544 parts In-Stock

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$1.500

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544

$1.500

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One Stop Electronics

USA . 1,452 parts In-Stock

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$6.500

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1,452

$6.500

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Parana Technologies

USA . 1,759 parts In-Stock

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$18.021

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$18.173

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1,759

$18.021

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$18.173

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AZTECH Wire

Italy . 317 parts In-Stock

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$18.998

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$18.998

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

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$20.248

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$19.236

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$18.223

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$18.223

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ChromeModa Solutions

Germany . 1,355 parts In-Stock

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$20.248

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$16.603

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$20.248

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Corohmni

South Africa . 533 parts In-Stock

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$20.928

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$21.694

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$20.609

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$20.609

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Corphita

USA . 2,957 parts In-Stock

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DigiPath Technology Company

USA . 2,228 parts In-Stock

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$18.256

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Continental Prestige Electronics

USA . 1,842 parts In-Stock

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Argo Parts USA

USA . 1,071 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

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Overview

Unlock precision and reliability with the REF200AUG4 by Texas Instruments, a cutting-edge solution in the realm of Other Function Semiconductors. With a focus on quality and innovation, Texas Instruments delivers a product that exceeds expectations. This versatile device offers dual functions and is ideal for a wide range of applications. Experience the value and benefits of the REF200AUG4, providing unmatched performance and accuracy in a compact package. Elevate your projects with this top-of-the-line analog circuit technology, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the semiconductor, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy and convenient assembly onto printed circuit boards, saving time and effort during manufacturing processes.

No. of Functions: 2

With multiple functions integrated into one component, this semiconductor offers versatility and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for space-saving and optimal placement on a PCB, making it suitable for compact electronic devices.

Nominal Supply Voltage (Vsup): 15 V

Operating at a stable supply voltage of 15V ensures consistent performance and compatibility with standard power sources.

Power Supplies (V): 15

This semiconductor is designed to efficiently handle power supplies of up to 15V, making it suitable for a wide range of applications.

No. of Terminals: 8

The presence of 8 terminals enables easy connection to other components, enhancing the versatility and functionality of the semiconductor.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for a higher density of components, ideal for compact electronic designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this semiconductor can withstand high temperature environments, ensuring reliability in challenging conditions.

Minimum Operating Temperature: -25 °C

Operating in temperatures as low as -25°C, this semiconductor is suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and enable easy connection to different parts of the circuit layout.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm allows for a slim profile and compact design, making it ideal for space-constrained applications.

Width (mm): 3.9 mm

The narrow width of 3.9mm facilitates easy placement on a PCB and allows for efficient use of board space.

Other IC type: ANALOG CIRCUIT

Being an analog circuit, this semiconductor is suitable for applications requiring continuous voltage and signal processing, offering high performance in such scenarios.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V ensures compatibility with lower voltage systems, expanding the range of possible applications for this semiconductor.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow temperature time of 30 seconds, this semiconductor can withstand reflow soldering processes efficiently, simplifying manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C indicates the semiconductor's ability to endure high-temperature soldering processes without damage.

Length: 4.9 mm

The length of 4.9mm offers a compact form factor, ideal for applications where space is limited and where a high component density is required.

No. of Channels: 2

With two channels integrated into one component, this semiconductor allows for processing multiple signals simultaneously, enhancing efficiency and performance.

Technology: BIPOLAR

Built using bipolar technology, this semiconductor offers high-speed operation and precise analog signal processing, making it suitable for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable solder connections, enhancing the durability and longevity of the semiconductor.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this semiconductor is compatible with standard PCB layouts and offers ease of assembly during manufacturing.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the semiconductor's ability to withstand moderate levels of moisture exposure, ensuring reliability in various environments.

Maximum Supply Voltage (Vsup): 40 V

Capable of handling supply voltages of up to 40V, this semiconductor is suitable for a wide range of high-power applications, providing versatility and compatibility.

Technical Specifications

Other Function Semiconductors REF200AUG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

REF200AUG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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