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ADC3660IRSBT

Texas Instruments

ADC3660IRSBT by Texas Instruments

Texas Instruments ADC3660IRSBT is a 16-bit ADC with 2 analog in channels, 65 MHz sample rate, and 0.006866455% linearity error. Ideal for industrial applications requiring high-speed data conversion with a wide temperature range. Package style: chip carrier, very thin profile, suitable for surface mount assembly.

Median Price

$74.980

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 279 parts In-Stock

1+ parts

$68.495

100+ parts

$66.435

1k+ parts

$51.500

10k+ parts

-

279

$68.495

$66.435

$51.500

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Arrow

USA . 32 parts In-Stock

1+ parts

$69.840

100+ parts

$66.040

1k+ parts

-

10k+ parts

-

32

$69.840

$66.040

-

-

Verical

USA . 32 parts In-Stock

1+ parts

$80.121

100+ parts

$75.946

1k+ parts

-

10k+ parts

-

32

$80.121

$75.946

-

-

Chip1Stop

Japan . 32 parts In-Stock

1+ parts

$80.546

100+ parts

$75.946

1k+ parts

-

10k+ parts

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32

$80.546

$75.946

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,800 parts In-Stock

1+ parts

$65.070

100+ parts

-

1k+ parts

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10k+ parts

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4,800

$65.070

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Vyrian

USA . 5,184 parts In-Stock

1+ parts

-

100+ parts

-

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5,184

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Chip Stock

USA . 2,995 parts In-Stock

1+ parts

-

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2,995

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 830 parts In-Stock

1+ parts

$9.512

100+ parts

-

1k+ parts

$10.110

10k+ parts

-

830

$9.512

-

$10.110

-

DigiPath Technology Company

USA . 333 parts In-Stock

1+ parts

$10.474

100+ parts

$9.636

1k+ parts

-

10k+ parts

-

333

$10.474

$9.636

-

-

ChromeModa Solutions

Germany . 4,936 parts In-Stock

1+ parts

$10.688

100+ parts

$8.764

1k+ parts

-

10k+ parts

-

4,936

$10.688

$8.764

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IDEA Electronic Components Group

UK . 1,782 parts In-Stock

1+ parts

$10.688

100+ parts

$10.154

1k+ parts

$9.619

10k+ parts

-

1,782

$10.688

$10.154

$9.619

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AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$11.620

100+ parts

-

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476

$11.620

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Corphita

USA . 4,246 parts In-Stock

1+ parts

$61.646

100+ parts

-

1k+ parts

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10k+ parts

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4,246

$61.646

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Component Stockers USA

USA . 198 parts In-Stock

1+ parts

$87.270

100+ parts

$115.210

1k+ parts

-

10k+ parts

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198

$87.270

$115.210

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Northwest PG Solutions

USA . 1,409 parts In-Stock

1+ parts

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1,409

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Native Components

USA . 213 parts In-Stock

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213

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Overview

Experience precision and reliability with the Texas Instruments ADC3660IRSBT Analog-to-Digital Converter. Crafted with top-quality materials and cutting-edge technology, this product offers unparalleled performance for a variety of applications. From industrial automation to medical devices, this ADC delivers accuracy and speed, ensuring seamless operation in any environment. Trust in Texas Instruments to provide you with the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple sources for conversion, making it versatile for different signal processing needs.

Surface Mount: YES

Surface mount capability makes installation and assembly of the product easier and more efficient, saving time and effort.

No. of Bits: 16

With a high resolution of 16 bits, this ADC can provide accurate and precise digital conversions of analog signals, ensuring quality outputs.

Maximum Linearity Error (EL): 0.006866455 %

The low linearity error percentage indicates high accuracy and reliability in converting analog signals to digital, making it a dependable choice for precise measurements.

No. of Terminals: 40

Having 40 terminals allows for multiple connection options, enabling compatibility with various systems and devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and thin profile design enhances thermal dissipation and compactness, making the product efficient and space-saving.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance ensures reliability and stability under challenging environmental conditions, increasing the product's durability and performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in both cold and hot environments, ensuring adaptability and functionality in various settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides corrosion resistance, enhancing the product's durability and longevity in demanding environments.

Technical Specifications

Analog-to-Digital Converters ADC3660IRSBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.006866455 %

Sample Rate:

65 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

78 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3660IRSBT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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