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ADC3582IRSBR

Texas Instruments

ADC3582IRSBR by Texas Instruments

Texas Instruments ADC3582IRSBR is an 18-bit ADC with 0.0061035% EL, 25 MHz sample rate, and 1.8V supply voltage. Ideal for applications requiring high precision analog-to-digital conversion in a compact form factor. Package style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE.

Median Price

$68.850

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,244 parts In-Stock

1+ parts

$68.850

100+ parts

$61.200

1k+ parts

$45.000

10k+ parts

-

3,244

$68.850

$61.200

$45.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,877 parts In-Stock

1+ parts

$65.408

100+ parts

-

1k+ parts

-

10k+ parts

-

4,877

$65.408

-

-

-

Vyrian

USA . 6,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,003

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 40 parts In-Stock

1+ parts

$16.670

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$16.670

-

-

-

Ampacity Inc.

Singapore . 3,197 parts In-Stock

1+ parts

$58.520

100+ parts

-

1k+ parts

-

10k+ parts

-

3,197

$58.520

-

-

-

Semicontronic

India . 2,759 parts In-Stock

1+ parts

$58.520

100+ parts

$57.057

1k+ parts

$56.764

10k+ parts

-

2,759

$58.520

$57.057

$56.764

-

Corphita

USA . 4,054 parts In-Stock

1+ parts

$61.965

100+ parts

-

1k+ parts

-

10k+ parts

-

4,054

$61.965

-

-

-

Corohmni

South Africa . 197 parts In-Stock

1+ parts

$68.850

100+ parts

-

1k+ parts

-

10k+ parts

-

197

$68.850

-

-

-

Northwest PG Solutions

USA . 2,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,353

-

-

-

-

Native Components

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

874

-

-

-

-

Overview

Experience exceptional quality with the ADC3582IRSBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable Analog-to-Digital Converters that are perfect for a variety of applications. With its high performance and precision, this product offers unmatched value and benefits to customers looking for top-notch solutions. Upgrade your projects with the superior capabilities of the ADC3582IRSBR and see the difference it can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and reducing overall system size.

No. of Bits: 18

The high number of bits allows for precise and accurate conversion of analog signals into digital data, making it suitable for applications requiring high resolution.

Maximum Linearity Error (EL): 0.0061035 %

The low linearity error ensures accurate and reliable conversion of analog signals, making it ideal for applications where precision is critical.

Maximum Operating Temperature: 105 °C

The wide operating temperature range allows the converter to be used in various environmental conditions without losing performance, making it suitable for a range of applications.

Output Format: SERIAL

The serial output format makes it compatible with a wide range of digital systems, allowing for easy integration and communication with other devices.

Technical Specifications

Analog-to-Digital Converters ADC3582IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061035 %

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

27 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3582IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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