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ADC3564IRSBT

Texas Instruments

ADC3564IRSBT by Texas Instruments

Texas Instruments ADC3564IRSBT is a 14-bit ADC with 0.0457763% linearity error, 125 MHz sample rate, and 1.8V supply voltage. Ideal for applications requiring high-speed analog-to-digital conversion in compact spaces. Package style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE.

Median Price

$82.090

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,057 parts In-Stock

1+ parts

$69.160

100+ parts

$67.080

1k+ parts

$52.000

10k+ parts

-

1,057

$69.160

$67.080

$52.000

-

DigiKey

USA . 245 parts In-Stock

1+ parts

$82.090

100+ parts

$65.000

1k+ parts

-

10k+ parts

-

245

$82.090

$65.000

-

-

Mouser Electronics

USA . 120 parts In-Stock

1+ parts

$93.040

100+ parts

$74.370

1k+ parts

$74.360

10k+ parts

-

120

$93.040

$74.370

$74.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,651 parts In-Stock

1+ parts

$65.702

100+ parts

-

1k+ parts

-

10k+ parts

-

1,651

$65.702

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$71.235

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$71.235

-

-

-

Vyrian

USA . 5,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,172

-

-

-

-

VNN

France . 1,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,190

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 332 parts In-Stock

1+ parts

$58.790

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$58.790

-

-

-

Corphita

USA . 4,877 parts In-Stock

1+ parts

$62.244

100+ parts

-

1k+ parts

-

10k+ parts

-

4,877

$62.244

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$71.235

100+ parts

$69.810

1k+ parts

-

10k+ parts

-

1,000

$71.235

$69.810

-

-

Microchip USA

USA . 2,239 parts In-Stock

1+ parts

$131.070

100+ parts

$128.790

1k+ parts

$127.650

10k+ parts

$126.510

2,239

$131.070

$128.790

$127.650

$126.510

Overview

Enhance your next project with the Texas Instruments ADC3564IRSBT Analog-to-Digital Converter. Crafted with precision and quality by a trusted manufacturer, this innovative product offers unparalleled performance in a compact package. With a sample rate of 125 MHz and 14 bits, this converter delivers accurate and reliable results for a wide range of applications. Whether you're in the automotive industry, telecommunications, or consumer electronics, the ADC3564IRSBT provides exceptional value and efficiency, making it the ideal choice for your design needs. Elevate your projects with this cutting-edge technology and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration into compact electronic designs, saving space and simplifying assembly.

No. of Bits: 14

High number of bits ensure accurate and precise conversion of analog signals to digital data, suitable for applications requiring high resolution.

Maximum Linearity Error (EL): 0.0457763 %

Low linearity error ensures accurate conversion and reliable performance in critical applications.

No. of Terminals: 40

Having multiple terminals allows for versatile connectivity options and ease of integration into complex circuits.

Maximum Operating Temperature: 105 °C

Wide operating temperature range ensures the product can perform reliably in various environmental conditions.

Maximum Analog Input Voltage: 3.2 V

High maximum analog input voltage range allows for versatile signal processing capabilities and compatibility with different input sources.

Sample Rate: 125 MHz

High sample rate enables rapid and accurate conversion of analog signals, suitable for applications requiring real-time data processing.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage ensures energy efficiency and compatibility with low-power electronic devices.

Technical Specifications

Analog-to-Digital Converters ADC3564IRSBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0457763 %

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

62 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3564IRSBT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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