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ADC3562IRSBR

Texas Instruments

ADC3562IRSBR by Texas Instruments

Texas Instruments ADC3562IRSBR is a 16-bit ADC with 0.007629395% EL, 25 MHz sample rate, and 1.8V supply voltage. Ideal for applications requiring high precision analog-to-digital conversion in compact spaces due to its small form factor and low power consumption of 27mA at max.

Median Price

$44.370

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,538 parts In-Stock

1+ parts

$44.370

100+ parts

$39.440

1k+ parts

$29.000

10k+ parts

-

9,538

$44.370

$39.440

$29.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,254 parts In-Stock

1+ parts

$42.152

100+ parts

-

1k+ parts

-

10k+ parts

-

1,254

$42.152

-

-

-

Vyrian

USA . 2,493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,493

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,182 parts In-Stock

1+ parts

$13.930

100+ parts

-

1k+ parts

-

10k+ parts

-

1,182

$13.930

-

-

-

Native Components

USA . 748 parts In-Stock

1+ parts

$27.263

100+ parts

-

1k+ parts

-

10k+ parts

-

748

$27.263

-

-

-

Northwest PG Solutions

USA . 920 parts In-Stock

1+ parts

$29.989

100+ parts

$26.990

1k+ parts

-

10k+ parts

-

920

$29.989

$26.990

-

-

Ampacity Inc.

Singapore . 9,301 parts In-Stock

1+ parts

$37.710

100+ parts

-

1k+ parts

-

10k+ parts

-

9,301

$37.710

-

-

-

Semicontronic

India . 9,192 parts In-Stock

1+ parts

$37.710

100+ parts

$36.767

1k+ parts

$36.579

10k+ parts

-

9,192

$37.710

$36.767

$36.579

-

Corphita

USA . 1,141 parts In-Stock

1+ parts

$39.933

100+ parts

-

1k+ parts

-

10k+ parts

-

1,141

$39.933

-

-

-

Corohmni

South Africa . 346 parts In-Stock

1+ parts

$44.370

100+ parts

-

1k+ parts

-

10k+ parts

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346

$44.370

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-

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Overview

Discover the cutting-edge ADC3562IRSBR by Texas Instruments, a high-quality Analog-to-Digital Converter that promises unmatched performance and reliability. With a focus on precision and innovation, Texas Instruments offers a product that is perfect for a wide range of applications. From industrial automation to medical devices, this ADC ensures optimal functionality and accuracy. Experience the value and benefits of superior technology with the ADC3562IRSBR, setting new standards in the industry. Trust Texas Instruments to deliver excellence in every aspect, providing you with the competitive edge you need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

No. of Bits: 16

High resolution for accurate conversion of analog signals to digital data.

Maximum Linearity Error (EL): 0.007629395%

Low error rate ensures precision in signal conversion.

Maximum Operating Temperature: 105 °C

Wide temperature range allows for reliable performance in various environments.

Sample Rate: 25 MHz

High sample rate enables fast conversion of analog signals to digital data.

Nominal Supply Voltage: 1.8 V

Low power consumption with nominal supply voltage for energy efficiency.

Technical Specifications

Analog-to-Digital Converters ADC3562IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.007629395 %

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

27 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3562IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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