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ADC34J43IRGZ25

Texas Instruments

ADC34J43IRGZ25 by Texas Instruments

ADC34J43IRGZ25 by Texas Instruments is a 14-bit ADC with 4 analog input channels, operating at a sample rate of 80 MHz. It features a serial output format and can handle max analog input voltages of ±2V. Ideal for industrial applications requiring high-speed data conversion in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,423 parts In-Stock

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Digiode

USA . 777 parts In-Stock

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777

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AZTECH Wire

Italy . 278 parts In-Stock

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$6.823

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One Stop Electronics

USA . 1,567 parts In-Stock

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$10.000

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Parana Technologies

USA . 970 parts In-Stock

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$14.980

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$15.406

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DigiPath Technology Company

USA . 1,342 parts In-Stock

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$16.495

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$15.176

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ChromeModa Solutions

Germany . 6,042 parts In-Stock

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$16.832

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$13.802

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$16.832

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IDEA Electronic Components Group

UK . 1,187 parts In-Stock

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$16.832

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$15.990

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$15.149

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$15.149

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Corphita

USA . 2,783 parts In-Stock

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Northwest PG Solutions

USA . 1,273 parts In-Stock

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Native Components

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Microchip USA

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Overview

Unlock unparalleled precision and performance with the ADC34J43IRGZ25 Analog-to-Digital Converter by Texas Instruments. Crafted with top-notch quality and expertise, this cutting-edge device boasts 4 analog input channels in a compact square package. Ideal for industrial applications, this converter offers a rapid sample rate of 80 MHz and a wide temperature range for reliable operation. Experience seamless data conversion with the ADC34J43IRGZ25, delivering unmatched value and benefits to elevate your projects to new heights. Trust Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to moisture and temperature changes, making this product suitable for a variety of environments.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile and simultaneous data conversion from multiple sources, increasing efficiency and flexibility in data acquisition.

Surface Mount: YES

Being surface mountable simplifies the assembly process and saves space on the PCB, making it ideal for compact designs and mass production.

No. of Bits: 14

With 14 bits resolution, this ADC can provide accurate and precise digital representation of analog signals, suitable for applications requiring high resolution.

No. of Terminals: 48

Having 48 terminals allows for connection to various external components and interfaces, enhancing the versatility and compatibility of this product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this ADC can perform reliably in demanding industrial environments without risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that this ADC can operate effectively in harsh cold conditions, expanding its usability in different environments.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V, this ADC provides low power consumption and is compatible with a wide range of power sources, making it energy-efficient and versatile.

Technical Specifications

Analog-to-Digital Converters ADC34J43IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

80 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC34J43IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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