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ADC34J42IRGZ25

Texas Instruments

ADC34J42IRGZ25 by Texas Instruments

Texas Instruments ADC34J42IRGZ25 is a 14-bit ADC with 4 analog channels, operating from -40 to 85°C. It offers a sample rate of 50 MHz and supports input voltages from -2V to +2V. Ideal for industrial applications requiring high-speed data conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,384 parts In-Stock

1+ parts

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5,384

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Digiode

USA . 2,193 parts In-Stock

1+ parts

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2,193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 998 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

$0.187

998

$0.195

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-

$0.187

Northwest PG Solutions

USA . 1,390 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

-

10k+ parts

$0.189

1,390

$0.214

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$0.189

One Stop Electronics

USA . 708 parts In-Stock

1+ parts

$6.000

100+ parts

-

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708

$6.000

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AZTECH Wire

Italy . 802 parts In-Stock

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$12.865

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802

$12.865

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Parana Technologies

USA . 1,974 parts In-Stock

1+ parts

$24.181

100+ parts

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$24.843

10k+ parts

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1,974

$24.181

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$24.843

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DigiPath Technology Company

USA . 849 parts In-Stock

1+ parts

$26.627

100+ parts

$24.496

1k+ parts

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849

$26.627

$24.496

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IDEA Electronic Components Group

UK . 1,149 parts In-Stock

1+ parts

$27.170

100+ parts

$25.812

1k+ parts

$24.453

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1,149

$27.170

$25.812

$24.453

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ChromeModa Solutions

Germany . 280 parts In-Stock

1+ parts

$27.170

100+ parts

$22.279

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280

$27.170

$22.279

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Component Stockers USA

USA . 657 parts In-Stock

1+ parts

$99.990

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657

$99.990

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Corphita

USA . 687 parts In-Stock

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Microchip USA

USA . 232 parts In-Stock

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Overview

Enhance your analog-to-digital conversion experience with the ADC34J42IRGZ25 by Texas Instruments. Crafted with precision and expertise, this top-tier converter boasts exceptional quality and reliability that Texas Instruments is renowned for. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking seamless integration and high-performance results. Elevate your projects with the ADC34J42IRGZ25 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components of the Analog-to-Digital Converter.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and throughput in data acquisition applications.

Surface Mount: YES

Being surface mount compatible makes the converter easy to integrate onto a PCB, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape helps in efficient placement on the PCB, optimizing space utilization in the design.

No. of Bits: 14

With 14 bits of resolution, the converter can provide accurate and detailed digital representation of the analog input signals, resulting in high precision data conversion.

No. of Terminals: 48

Having 48 terminals allows for more connectivity options and flexibility in the design and integration of the converter within a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles help in efficient heat dissipation, compact design, and compatibility with space-constrained applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature range of 85°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in a wide range of temperature conditions, making the converter versatile and adaptable.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal position facilitates easy connectivity and soldering of the converter within a system, enhancing installation convenience.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, the converter can be integrated into compact designs and applications with height restrictions.

Width: 7 mm

The 7 mm width offers compatibility with standard PCB layouts and facilitates easy placement and connection of the converter within the system.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly of the converter onto the PCB, maintaining structural integrity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering and secure attachment of the converter on the PCB during manufacturing processes.

Length: 7 mm

The 7 mm length offers a compact form factor for the converter, allowing for space-efficient integration into various electronic devices and systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in industrial environments with varying temperature conditions, making the converter suitable for industrial applications.

Maximum Analog Input Voltage: 2 V

With a maximum analog input voltage of 2 V, the converter can accurately convert a wide range of analog input signals, increasing its applicability in diverse signal processing tasks.

Sample Rate: 50 MHz

A high sample rate of 50 MHz allows for fast and accurate conversion of analog signals into digital data, enabling real-time processing and analysis of signals.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and helps in reducing the risk of lead contamination, ensuring environmental sustainability.

Converter Type: ADC, PROPRIETARY METHOD

The use of a proprietary method in the ADC design enhances the performance and efficiency of the converter, offering unique features and capabilities for signal conversion.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures low power consumption and efficient operation of the converter, making it suitable for battery-powered and power-sensitive applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Supporting offset binary and 2's complement binary output bit codes provides flexibility in data representation and processing, catering to various digital signal processing requirements.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch offers compatibility with standard PCB layouts and facilitates easy connection and integration of the converter into electronic systems.

Minimum Analog Input Voltage: -2 V

With a minimum analog input voltage of -2 V, the converter can accurately convert negative input signals without distortion, expanding its range of applicability.

Output Format: SERIAL

The serial output format enables easy interfacing with microcontrollers and digital signal processors, simplifying data transmission and processing in embedded systems.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the converter is suitable for reflow soldering processes with multiple exposures to high temperatures, ensuring reliable performance during assembly.

Technical Specifications

Analog-to-Digital Converters ADC34J42IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

50 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC34J42IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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