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ADC34J25IRGZR

Texas Instruments

ADC34J25IRGZR by Texas Instruments

The Texas Instruments ADC34J25IRGZR is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 160 MHz. It features a max analog input voltage of ±2V and output in serial format. Ideal for industrial applications requiring high-speed data conversion in compact spaces due to its small package size and low power consumption.

Median Price

$65.029

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,448 parts In-Stock

1+ parts

$65.029

100+ parts

$63.073

1k+ parts

$48.894

10k+ parts

-

2,448

$65.029

$63.073

$48.894

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,785 parts In-Stock

1+ parts

$61.778

100+ parts

-

1k+ parts

-

10k+ parts

-

2,785

$61.778

-

-

-

Vyrian

USA . 4,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,248

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 647 parts In-Stock

1+ parts

$6.362

100+ parts

-

1k+ parts

$7.113

10k+ parts

-

647

$6.362

-

$7.113

-

DigiPath Technology Company

USA . 1,421 parts In-Stock

1+ parts

$7.005

100+ parts

$6.445

1k+ parts

-

10k+ parts

-

1,421

$7.005

$6.445

-

-

ChromeModa Solutions

Germany . 2,368 parts In-Stock

1+ parts

$7.148

100+ parts

$5.861

1k+ parts

-

10k+ parts

-

2,368

$7.148

$5.861

-

-

IDEA Electronic Components Group

UK . 965 parts In-Stock

1+ parts

$7.148

100+ parts

-

1k+ parts

$6.433

10k+ parts

-

965

$7.148

-

$6.433

-

AZTECH Wire

Italy . 1,214 parts In-Stock

1+ parts

$13.390

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$13.390

-

-

-

Native Components

USA . 284 parts In-Stock

1+ parts

$15.506

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$15.506

-

-

-

Northwest PG Solutions

USA . 61 parts In-Stock

1+ parts

$17.057

100+ parts

$15.351

1k+ parts

-

10k+ parts

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61

$17.057

$15.351

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-

Corphita

USA . 4,473 parts In-Stock

1+ parts

$58.526

100+ parts

-

1k+ parts

-

10k+ parts

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4,473

$58.526

-

-

-

Microchip USA

USA . 5,295 parts In-Stock

1+ parts

$149.570

100+ parts

$146.970

1k+ parts

$145.670

10k+ parts

$144.360

5,295

$149.570

$146.970

$145.670

$144.360

Component Stockers USA

USA . 101 parts In-Stock

1+ parts

$782.030

100+ parts

-

1k+ parts

-

10k+ parts

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101

$782.030

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-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

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Lixinc

USA . 3,903 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,903

-

-

-

-

Overview

Unlock precision and accuracy with the Texas Instruments ADC34J25IRGZR Analog-to-Digital Converter. Crafted with excellence by Texas Instruments, this cutting-edge product offers unparalleled quality and reliability. Ideal for a wide range of applications, this converter is designed to provide seamless integration and exceptional performance. Experience the value and benefits of this top-tier product, delivering precision and efficiency like never before. Elevate your projects with the Texas Instruments ADC34J25IRGZR Analog-to-Digital Converter today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

No. of Analog In Channels: 4

Provides flexibility to connect to multiple analog sources.

Surface Mount: YES

Enables easy and convenient mounting on circuit boards.

No. of Bits: 12

Provides high resolution for accurate analog-to-digital conversion.

No. of Terminals: 48

Sufficient terminals for connections and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers versatile package styles for diverse application requirements.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows operation in varying environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

High-quality terminal finish for enhanced conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position for efficient connectivity and signal transmission.

Width: 7 mm

Compact width for space-saving design and integration.

Sample Rate: 160 MHz

High sample rate ensures fast and accurate analog-to-digital conversion.

Converter Type: ADC, PROPRIETARY METHOD

Utilizes proprietary method for precise and customized analog-to-digital conversion.

Nominal Supply Voltage: 1.8 V

Low supply voltage for energy-efficient operation.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Flexible output bit code options for compatibility with different systems.

Output Format: SERIAL

Serial output format for easy data transmission and processing.

Technical Specifications

Analog-to-Digital Converters ADC34J25IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

160 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

150 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC34J25IRGZR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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