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ADC34J24IRGZR

Texas Instruments

ADC34J24IRGZR by Texas Instruments

Texas Instruments ADC34J24IRGZR is a 12-bit ADC with 4 analog channels, operating at 160 MHz. Ideal for industrial applications, it offers a max analog input voltage of ±2V and low supply current of 490mA. With a compact square package style and high-speed serial output format, it suits various electronic designs.

Median Price

$69.245

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,376 parts In-Stock

1+ parts

$69.245

100+ parts

$61.551

1k+ parts

$45.258

10k+ parts

-

3,376

$69.245

$61.551

$45.258

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,225 parts In-Stock

1+ parts

$65.783

100+ parts

-

1k+ parts

-

10k+ parts

-

3,225

$65.783

-

-

-

Vyrian

USA . 8,197 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

8,197

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 370 parts In-Stock

1+ parts

$14.321

100+ parts

-

1k+ parts

$14.771

10k+ parts

-

370

$14.321

-

$14.771

-

DigiPath Technology Company

USA . 1,174 parts In-Stock

1+ parts

$15.769

100+ parts

$14.508

1k+ parts

-

10k+ parts

-

1,174

$15.769

$14.508

-

-

ChromeModa Solutions

Germany . 6,906 parts In-Stock

1+ parts

$16.091

100+ parts

$13.195

1k+ parts

-

10k+ parts

-

6,906

$16.091

$13.195

-

-

IDEA Electronic Components Group

UK . 483 parts In-Stock

1+ parts

$16.091

100+ parts

$15.286

1k+ parts

$14.482

10k+ parts

-

483

$16.091

$15.286

$14.482

-

AZTECH Wire

Italy . 1,140 parts In-Stock

1+ parts

$17.590

100+ parts

-

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1,140

$17.590

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Corphita

USA . 1,892 parts In-Stock

1+ parts

$62.320

100+ parts

-

1k+ parts

-

10k+ parts

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1,892

$62.320

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-

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Microchip USA

USA . 4,268 parts In-Stock

1+ parts

$135.730

100+ parts

$133.370

1k+ parts

$132.190

10k+ parts

$131.010

4,268

$135.730

$133.370

$132.190

$131.010

Lixinc

USA . 19,425 parts In-Stock

1+ parts

-

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19,425

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,000

-

-

-

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Northwest PG Solutions

USA . 568 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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568

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Native Components

USA . 534 parts In-Stock

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1k+ parts

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534

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Overview

Experience precision and reliability like never before with the ADC34J24IRGZR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters that are perfect for a wide range of applications. With a high sample rate of 160 MHz and a maximum analog input voltage of 2V, this converter is ideal for industrial-grade projects. Say goodbye to compromise and hello to unparalleled performance. Trust Texas Instruments to provide you with the quality and value you deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple input signals to be processed simultaneously, increasing efficiency and productivity in data conversion tasks.

Surface Mount: YES

The surface mount feature makes the product easy to install and saves valuable space on a circuit board, making it suitable for compact electronic devices.

No. of Bits: 12

With a 12-bit resolution, this ADC can provide more accurate and precise digital representation of analog signals, suitable for high-quality conversion requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enables the product to function reliably in a wide range of environmental conditions, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish with nickel, palladium, gold, and silver enhances conductivity, corrosion resistance, and longevity of the product, ensuring stable performance over time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure solder connections during assembly processes, contributing to the product's reliability and durability.

Max Supply Current: 490 mA

With a maximum supply current of 490 mA, the product can handle high-power operation, making it suitable for demanding applications that require efficient power management.

Technical Specifications

Analog-to-Digital Converters ADC34J24IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

160 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

490 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC34J24IRGZR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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