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ADC3441IRTQT

Texas Instruments

ADC3441IRTQT by Texas Instruments

ADC, PROPRIETARY METHOD; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$31.472

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 218 parts In-Stock

1+ parts

$26.160

100+ parts

$25.640

1k+ parts

$25.110

10k+ parts

-

218

$26.160

$25.640

$25.110

-

Texas Instruments

USA . 5,351 parts In-Stock

1+ parts

$36.784

100+ parts

$32.697

1k+ parts

$24.042

10k+ parts

-

5,351

$36.784

$32.697

$24.042

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,622 parts In-Stock

1+ parts

$34.945

100+ parts

-

1k+ parts

-

10k+ parts

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2,622

$34.945

-

-

-

Vyrian

USA . 7,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,868

-

-

-

-

VNN

France . 3,107 parts In-Stock

1+ parts

-

100+ parts

-

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3,107

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-

-

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Chip Stock

USA . 477 parts In-Stock

1+ parts

-

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-

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477

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-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$12.110

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$12.110

-

-

-

Parana Technologies

USA . 1,808 parts In-Stock

1+ parts

$20.857

100+ parts

-

1k+ parts

$21.037

10k+ parts

-

1,808

$20.857

-

$21.037

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ChromeModa Solutions

Germany . 4,670 parts In-Stock

1+ parts

$23.435

100+ parts

$19.217

1k+ parts

-

10k+ parts

-

4,670

$23.435

$19.217

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-

IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$23.435

100+ parts

$22.263

1k+ parts

$21.092

10k+ parts

-

792

$23.435

$22.263

$21.092

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Ampacity Inc.

Singapore . 5,317 parts In-Stock

1+ parts

$31.270

100+ parts

-

1k+ parts

-

10k+ parts

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5,317

$31.270

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-

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Corphita

USA . 3,491 parts In-Stock

1+ parts

$33.106

100+ parts

-

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10k+ parts

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3,491

$33.106

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-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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500

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-

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DigiPath Technology Company

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$21.129

1k+ parts

-

10k+ parts

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220

-

$21.129

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-

Technical Specifications

Analog-to-Digital Converters ADC3441IRTQT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

162 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Trade Compliance

ADC3441IRTQT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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