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ADC32RF45IRMPT

Texas Instruments

ADC32RF45IRMPT by Texas Instruments

Texas Instruments ADC32RF45IRMPT is a 14-bit ADC with 2 analog in channels, 300 MHz sample rate, and max analog input voltage of ±1.35V. Ideal for industrial applications requiring high-speed data conversion in a compact square chip carrier package.

Median Price

$1,579.200

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,493 parts In-Stock

1+ parts

$1,579.200

100+ parts

$1,447.600

1k+ parts

$1,316.000

10k+ parts

-

1,493

$1,579.200

$1,447.600

$1,316.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,098 parts In-Stock

1+ parts

$1,500.240

100+ parts

-

1k+ parts

-

10k+ parts

-

4,098

$1,500.240

-

-

-

Vyrian

USA . 4,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,227

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,355 parts In-Stock

1+ parts

$1.000

100+ parts

$775.120

1k+ parts

$754.730

10k+ parts

$734.330

2,355

$1.000

$775.120

$754.730

$734.330

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$14.200

100+ parts

-

1k+ parts

-

10k+ parts

-

574

$14.200

-

-

-

Parana Technologies

USA . 1,530 parts In-Stock

1+ parts

$22.648

100+ parts

-

1k+ parts

$23.307

10k+ parts

-

1,530

$22.648

-

$23.307

-

DigiPath Technology Company

USA . 820 parts In-Stock

1+ parts

$24.938

100+ parts

$22.943

1k+ parts

-

10k+ parts

-

820

$24.938

$22.943

-

-

IDEA Electronic Components Group

UK . 1,435 parts In-Stock

1+ parts

$25.447

100+ parts

$24.175

1k+ parts

$22.902

10k+ parts

-

1,435

$25.447

$24.175

$22.902

-

ChromeModa Solutions

Germany . 1,167 parts In-Stock

1+ parts

$25.447

100+ parts

$20.867

1k+ parts

-

10k+ parts

-

1,167

$25.447

$20.867

-

-

Native Components

USA . 297 parts In-Stock

1+ parts

$214.660

100+ parts

-

1k+ parts

-

10k+ parts

$206.074

297

$214.660

-

-

$206.074

Northwest PG Solutions

USA . 398 parts In-Stock

1+ parts

$236.126

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$236.126

-

-

-

Corphita

USA . 2,778 parts In-Stock

1+ parts

$1,421.280

100+ parts

-

1k+ parts

-

10k+ parts

-

2,778

$1,421.280

-

-

-

Lixinc

USA . 14,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,478

-

-

-

-

Robosynatics

Brazil . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

Lucentia Tech

USA . 950 parts In-Stock

1+ parts

-

100+ parts

$5.938

1k+ parts

$5.499

10k+ parts

$5.499

950

-

$5.938

$5.499

$5.499

Overview

Unleash the power of precision with the ADC32RF45IRMPT by Texas Instruments. This Analog-to-Digital Converter offers unparalleled quality and reliability, backed by the reputable manufacturer's commitment to excellence. Ideal for a wide range of applications, this versatile component provides customers with exceptional value and performance. Experience the benefits of cutting-edge technology in a compact package, delivering seamless functionality and accuracy that exceeds expectations. Choose Texas Instruments for superior solutions that elevate your projects to new heights.

Feature Benefit Bullets

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple sources to the converter.

Surface Mount: YES

Surface mount capability makes it easier and more convenient to integrate this converter into a circuit board.

Package Shape: SQUARE

Square package shape helps in saving space and optimizing board layout.

No. of Bits: 14

With 14 bits of resolution, this converter can provide high accuracy and precision in digitizing analog signals.

No. of Terminals: 72

Having a high number of terminals allows for more connectivity options and better signal routing.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer versatility in design and application, catering to different requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Gold finish on terminals ensures good conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position simplifies the installation and connection process.

Maximum Seated Height: 0.9 mm

Low seated height enables compact and slim designs.

Width: 10 mm

Compact width allows for efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature helps in preventing thermal damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability.

Length: 10 mm

Compact length complements the overall small form factor of the converter.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes this converter suitable for harsh environments and industrial applications.

Maximum Analog Input Voltage: 1.35 V

High maximum analog input voltage capability allows for interfacing with a wide range of signal sources.

Sample Rate: 300 MHz

High sample rate enables rapid and accurate conversion of analog signals.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Converter Type: ADC, PROPRIETARY METHOD

Proprietary ADC method may offer unique advantages and performance enhancements.

Nominal Supply Voltage: 1.15 V

Low nominal supply voltage helps in minimizing power consumption and heat dissipation.

Output Bit Code: BINARY

Binary output bit code simplifies processing and manipulation of digital data.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact layouts.

Minimum Analog Input Voltage: -1.35 V

Wide range of analog input voltage ensures compatibility with various signal sources.

Output Format: SERIAL

Serial output format facilitates easy interfacing with microcontrollers and other digital systems.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold functionality helps in capturing and retaining input signals for accurate conversion.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly and storage.

Technical Specifications

Analog-to-Digital Converters ADC32RF45IRMPT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

300 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-1.35 V

Maximum Analog Input Voltage:

1.35 V

Nominal Supply Voltage:

1.15 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

72

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Trade Compliance

ADC32RF45IRMPT Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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