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ADC32J43IRGZ25

Texas Instruments

ADC32J43IRGZ25 by Texas Instruments

Texas Instruments ADC32J43IRGZ25 is a 14-bit ADC with 2 analog in channels, 80 MHz sample rate, and 0.0092% max linearity error. Ideal for industrial applications requiring high-speed data conversion in a compact chip carrier package. Operating temperature range -40 to 85°C makes it suitable for various environments.

Median Price

$68.620

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 21 parts In-Stock

1+ parts

$68.620

100+ parts

$45.000

1k+ parts

-

10k+ parts

-

21

$68.620

$45.000

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,013 parts In-Stock

1+ parts

$56.990

100+ parts

-

1k+ parts

-

10k+ parts

-

4,013

$56.990

-

-

-

Vyrian

USA . 6,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,340

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 636 parts In-Stock

1+ parts

$19.256

100+ parts

-

1k+ parts

$19.290

10k+ parts

-

636

$19.256

-

$19.290

-

ChromeModa Solutions

Germany . 5,984 parts In-Stock

1+ parts

$21.636

100+ parts

$17.742

1k+ parts

-

10k+ parts

-

5,984

$21.636

$17.742

-

-

IDEA Electronic Components Group

UK . 1,734 parts In-Stock

1+ parts

$21.636

100+ parts

$20.554

1k+ parts

$19.472

10k+ parts

-

1,734

$21.636

$20.554

$19.472

-

Corphita

USA . 3,731 parts In-Stock

1+ parts

$53.991

100+ parts

-

1k+ parts

-

10k+ parts

-

3,731

$53.991

-

-

-

Ampacity Inc.

Singapore . 21 parts In-Stock

1+ parts

$58.330

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$58.330

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-

-

Component Stockers USA

USA . 21 parts In-Stock

1+ parts

$59.040

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$59.040

-

-

-

Microchip USA

USA . 124 parts In-Stock

1+ parts

$100.190

100+ parts

$98.450

1k+ parts

$97.570

10k+ parts

$96.700

124

$100.190

$98.450

$97.570

$96.700

DigiPath Technology Company

USA . 1,403 parts In-Stock

1+ parts

-

100+ parts

$19.507

1k+ parts

-

10k+ parts

-

1,403

-

$19.507

-

-

Northwest PG Solutions

USA . 1,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.479

10k+ parts

-

1,345

-

-

$4.479

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Native Components

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.433

10k+ parts

-

180

-

-

$4.433

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Overview

Unlock the power of precision with the Texas Instruments ADC32J43IRGZ25 Analog-to-Digital Converter. Crafted with superior quality and cutting-edge technology, this product offers unparalleled performance in a compact package. Ideal for a wide range of applications, this converter delivers accurate results with minimal error, making it a valuable asset for any project. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility and input options in data acquisition and conversion.

Surface Mount: YES

Surface mount capability makes installation and integration easier, saving time and effort in assembly.

No. of Bits: 14

With 14 bits resolution, this ADC can provide highly accurate and detailed conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0092 %

The low maximum linearity error ensures precision in converting analog signals to digital values without significant distortion.

No. of Terminals: 48

Having 48 terminals provides flexibility in connecting the ADC to other components and peripherals for data processing and analysis.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this ADC can function effectively in harsh and cold environments.

Technical Specifications

Analog-to-Digital Converters ADC32J43IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

80 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC32J43IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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