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ADC32J22IRGZT

Texas Instruments

ADC32J22IRGZT by Texas Instruments

Texas Instruments ADC32J22IRGZT is a 12-bit ADC with 2 analog in channels, operating from -40 to 85°C. It offers a sample rate of 160 MHz and max analog input voltage of ±2V. Ideal for industrial applications requiring high-speed data conversion in compact form factor.

Median Price

$18.877

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,837 parts In-Stock

1+ parts

$18.877

100+ parts

$16.780

1k+ parts

$12.338

10k+ parts

-

3,837

$18.877

$16.780

$12.338

-

Rochester

USA . 234 parts In-Stock

1+ parts

-

100+ parts

$17.370

1k+ parts

$15.540

10k+ parts

$14.620

234

-

$17.370

$15.540

$14.620

DigiKey

USA . 234 parts In-Stock

1+ parts

-

100+ parts

$22.850

1k+ parts

-

10k+ parts

-

234

-

$22.850

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,260 parts In-Stock

1+ parts

$16.283

100+ parts

-

1k+ parts

-

10k+ parts

-

4,260

$16.283

-

-

-

Vyrian

USA . 7,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,223

-

-

-

-

DigiKey Marketplace

USA . 234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

234

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 425 parts In-Stock

1+ parts

$0.516

100+ parts

-

1k+ parts

-

10k+ parts

-

425

$0.516

-

-

-

Northwest PG Solutions

USA . 943 parts In-Stock

1+ parts

$0.568

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$0.568

-

-

-

Parana Technologies

USA . 1,026 parts In-Stock

1+ parts

$12.087

100+ parts

-

1k+ parts

$12.498

10k+ parts

-

1,026

$12.087

-

$12.498

-

DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$13.309

100+ parts

$12.245

1k+ parts

-

10k+ parts

-

1,453

$13.309

$12.245

-

-

ChromeModa Solutions

Germany . 2,369 parts In-Stock

1+ parts

$13.581

100+ parts

$11.136

1k+ parts

-

10k+ parts

-

2,369

$13.581

$11.136

-

-

IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$13.581

100+ parts

$12.902

1k+ parts

$12.223

10k+ parts

-

2,210

$13.581

$12.902

$12.223

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Corphita

USA . 1,693 parts In-Stock

1+ parts

$15.426

100+ parts

-

1k+ parts

-

10k+ parts

-

1,693

$15.426

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

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-

Overview

Elevate your analog-to-digital conversion experience with the ADC32J22IRGZT by Texas Instruments. Crafted with precision and quality, this cutting-edge converter boasts a myriad of applications in various industries. From its durable package body material to its high sample rate of 160 MHz, this product is designed to deliver unmatched performance and reliability. Experience seamless integration and exceptional value with Texas Instruments' ADC32J22IRGZT, a true game-changer in the world of analog-to-digital converters.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable or rugged applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options and makes the product suitable for applications requiring multiple inputs.

Surface Mount: YES

Being surface mountable makes installation and assembly of the product easier and more efficient.

No. of Bits: 12

With a high resolution of 12 bits, the product can provide accurate and detailed digital conversion of analog signals.

No. of Terminals: 48

The large number of terminals allows for versatile connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function even in extremely cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of high-quality terminal finish materials ensures good conductivity and long-term reliability of the connections.

Terminal Position: QUAD

The quad terminal position provides stable connection points for versatile circuit configurations.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and slim designs, saving space in the overall product configuration.

Technical Specifications

Analog-to-Digital Converters ADC32J22IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

160 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC32J22IRGZT Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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