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ADC3221IRGZR

Texas Instruments

ADC3221IRGZR by Texas Instruments

Texas Instruments ADC3221IRGZR is a 12-bit ADC with 2 analog in channels, operating from -40 to 85°C. It has a sample rate of 125 MHz and max analog input voltage of ±2V. Ideal for industrial applications requiring high-speed data conversion in compact form factors.

Median Price

$13.776

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,007 parts In-Stock

1+ parts

$16.036

100+ parts

$14.007

1k+ parts

$9.660

10k+ parts

-

31,007

$16.036

$14.007

$9.660

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Arrow

USA . 2,500 parts In-Stock

1+ parts

-

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-

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10k+ parts

$11.516

2,500

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-

$11.516

Distributors (In-Stock)

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Digiode

USA . 902 parts In-Stock

1+ parts

$15.234

100+ parts

-

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902

$15.234

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Vyrian

USA . 8,303 parts In-Stock

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8,303

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Distributors (Availability)

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Native Components

USA . 592 parts In-Stock

1+ parts

$0.505

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-

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592

$0.505

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Northwest PG Solutions

USA . 1,635 parts In-Stock

1+ parts

$0.555

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-

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$0.490

1,635

$0.555

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-

$0.490

Corphita

USA . 1,954 parts In-Stock

1+ parts

$14.432

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1,954

$14.432

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AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$18.870

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218

$18.870

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Parana Technologies

USA . 1 parts In-Stock

1+ parts

$20.459

100+ parts

-

1k+ parts

$20.514

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1

$20.459

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$20.514

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ChromeModa Solutions

Germany . 3,607 parts In-Stock

1+ parts

$22.988

100+ parts

$18.850

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3,607

$22.988

$18.850

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IDEA Electronic Components Group

UK . 207 parts In-Stock

1+ parts

$22.988

100+ parts

$21.839

1k+ parts

$20.689

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207

$22.988

$21.839

$20.689

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Lixinc

USA . 11,673 parts In-Stock

1+ parts

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11,673

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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DigiPath Technology Company

USA . 644 parts In-Stock

1+ parts

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100+ parts

$20.726

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644

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$20.726

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Overview

Experience the unmatched precision and reliability of Texas Instruments with the ADC3221IRGZR Analog-to-Digital Converter. This cutting-edge technology offers unparalleled performance in a compact package, making it ideal for a wide range of applications. With advanced features and a robust design, this product delivers exceptional value to customers seeking high-quality solutions for their analog-to-digital conversion needs. Trust Texas Instruments for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components within the package, ensuring a longer lifespan for the product.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple input sources, making the product suitable for applications that require multi-channel analog-to-digital conversion.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for efficient integration onto circuit boards, saving space and reducing overall manufacturing costs.

No. of Bits: 12

A 12-bit resolution provides a high level of accuracy in converting analog signals to digital data, making the product suitable for applications where precision is crucial.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for industrial environments with varying temperature conditions.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8V makes this product energy-efficient and ideal for battery-operated devices or applications where power consumption is a concern.

Output Format: SERIAL

The serial output format allows for easy interfacing with microcontrollers and other digital systems, simplifying integration and data transmission processes.

Technical Specifications

Analog-to-Digital Converters ADC3221IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC3221IRGZR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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