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74SSTUB32864AZKER

Texas Instruments

74SSTUB32864AZKER by Texas Instruments

Texas Instruments 74SSTUB32864AZKER is a TTL technology latch with 25 bits, 0.7 ns propagation delay, and 410 MHz max frequency. Ideal for applications requiring fast data transfer and precise timing in commercial-grade environments.

Median Price

$6.590

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$5.700

1k+ parts

$5.100

10k+ parts

$4.800

2,000

-

$5.700

$5.100

$4.800

DigiKey

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$6.590

1k+ parts

-

10k+ parts

-

2,000

-

$6.590

-

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$7.125

1k+ parts

$6.375

10k+ parts

$6.000

2,000

-

$7.125

$6.375

$6.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 761 parts In-Stock

1+ parts

$6.023

100+ parts

-

1k+ parts

-

10k+ parts

-

761

$6.023

-

-

-

Vyrian

USA . 1,340 parts In-Stock

1+ parts

$6.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,340

$6.340

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 543 parts In-Stock

1+ parts

$5.706

100+ parts

-

1k+ parts

-

10k+ parts

-

543

$5.706

-

-

-

Parana Technologies

USA . 169 parts In-Stock

1+ parts

$15.628

100+ parts

-

1k+ parts

$15.996

10k+ parts

-

169

$15.628

-

$15.996

-

DigiPath Technology Company

USA . 108 parts In-Stock

1+ parts

$17.208

100+ parts

$15.831

1k+ parts

-

10k+ parts

-

108

$17.208

$15.831

-

-

IDEA Electronic Components Group

UK . 1,834 parts In-Stock

1+ parts

$17.559

100+ parts

$16.681

1k+ parts

$15.803

10k+ parts

-

1,834

$17.559

$16.681

$15.803

-

ChromeModa Solutions

Germany . 49 parts In-Stock

1+ parts

$17.559

100+ parts

$14.398

1k+ parts

-

10k+ parts

-

49

$17.559

$14.398

-

-

Northwest PG Solutions

USA . 2,226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,226

-

-

-

-

Kepictronics

USA . 946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

946

-

-

-

-

Native Components

USA . 747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

747

-

-

-

-

Robosynatics

Brazil . 589 parts In-Stock

1+ parts

-

100+ parts

$21.870

1k+ parts

$20.252

10k+ parts

$20.252

589

-

$21.870

$20.252

$20.252

Lucentia Tech

USA . 589 parts In-Stock

1+ parts

-

100+ parts

$21.870

1k+ parts

$20.252

10k+ parts

$20.252

589

-

$21.870

$20.252

$20.252

Microchip USA

USA . 436 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

436

-

-

-

-

Overview

Unlock the potential of your electronic designs with the Texas Instruments 74SSTUB32864AZKER Latch & Flip-Flop. Manufactured by industry leader Texas Instruments, this high-quality component offers lightning-fast 0.7ns propagation delay and a compact rectangular package. Ideal for a wide range of applications, from consumer electronics to industrial equipment, this versatile product provides exceptional value and performance. Trust in Texas Instruments for superior quality and reliability, and take your projects to the next level with the 74SSTUB32864AZKER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this latch & flip-flop lightweight and durable.

Propagation Delay At Nominal Supply: 0.7 ns

The low propagation delay of 0.7 ns ensures fast and efficient operation of the latch & flip-flop.

Surface Mount: YES

Being surface mountable makes this product easier to integrate into electronic circuits and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 1.8

The 1.8V nominal supply voltage ensures compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this latch & flip-flop is suitable for various environmental conditions.

Technical Specifications

Latches & Flip-Flops 74SSTUB32864AZKER attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

SSTU

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4100000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

25

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Propagation Delay At Nominal Supply:

.7 ns

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

410 MHz

Trade Compliance

74SSTUB32864AZKER Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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