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74LVCHR16245AZRDR

Texas Instruments

74LVCHR16245AZRDR by Texas Instruments

74LVCHR16245AZRDR by Texas Instruments is a bus driver & transceiver with 8 bits and 2 functions. It operates at a nominal voltage of 1.8V, has a propagation delay of 4.8ns, and features a max operating temperature of 85°C. Ideal for industrial applications requiring bidirectional control with common control type.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,782 parts In-Stock

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5,782

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Digiode

USA . 1,754 parts In-Stock

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1,754

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,258 parts In-Stock

1+ parts

$14.212

100+ parts

$1,319.755

1k+ parts

$12.790

10k+ parts

-

1,258

$14.212

$1,319.755

$12.790

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DigiPath Technology Company

USA . 562 parts In-Stock

1+ parts

$15.649

100+ parts

$14.397

1k+ parts

-

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562

$15.649

$14.397

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ChromeModa Solutions

Germany . 3,065 parts In-Stock

1+ parts

$15.968

100+ parts

$13.094

1k+ parts

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3,065

$15.968

$13.094

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IDEA Electronic Components Group

UK . 1,380 parts In-Stock

1+ parts

$15.968

100+ parts

$15.170

1k+ parts

$14.371

10k+ parts

-

1,380

$15.968

$15.170

$14.371

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AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$17.140

100+ parts

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422

$17.140

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One Stop Electronics

USA . 489 parts In-Stock

1+ parts

$64.000

100+ parts

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489

$64.000

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Andel Nordic

Denmark . 439 parts In-Stock

1+ parts

$74.182

100+ parts

-

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$71.215

10k+ parts

$71.215

439

$74.182

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$71.215

$71.215

Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 265 parts In-Stock

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265

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Microchip USA

USA . 203 parts In-Stock

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Northwest PG Solutions

USA . 200 parts In-Stock

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200

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Native Components

USA . 35 parts In-Stock

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Overview

Enhance your electronic designs with the 74LVCHR16245AZRDR by Texas Instruments! As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This bus driver & transceiver is perfect for applications requiring seamless communication between multiple components. With a fast propagation delay, low power consumption, and a wide operating temperature range, this product offers exceptional value and performance. Upgrade your projects today with the Texas Instruments 74LVCHR16245AZRDR for efficient and reliable data transmission.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 4.8 ns

With a low propagation delay at nominal supply voltage, this product ensures fast and efficient data transmission.

Surface Mount: YES

Being surface mountable, this product simplifies the manufacturing process and provides space-saving benefits.

No. of Functions: 2

Having multiple functions built into one component reduces the need for separate devices, saving on cost and board space.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration and alignment on circuit boards, enhancing overall system design.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V results in reduced power consumption and heat dissipation, making the product energy-efficient.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures optimal performance and signal integrity in high-speed data transmission applications.

Power Supplies (V): 3.3

The availability of multiple power supply voltages (3.3V) offers flexibility in system design and compatibility with various voltage levels.

No. of Terminals: 54

Having a high number of terminals allows for versatile connectivity options and functionality within the circuit.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enables high-density mounting, contributing to compact and streamlined PCB layouts.

Maximum I (ol): 12 Amp

The high maximum output current rating of 12A ensures robust performance and reliability under heavy load conditions.

Propagation Delay (tpd): 12.5 ns

With a low propagation delay, the product facilitates fast signal transmission, reducing latency and improving overall system efficiency.

Maximum Operating Temperature: 85 °C

The wide maximum operating temperature range of 85°C makes the product suitable for use in harsh environmental conditions or industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor configuration allows for flexible output control and signal isolation, enhancing system functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability for reliable electrical connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB assembly and ensures secure mechanical support for the component.

No. of Ports: 2

The dual port design allows for versatile input/output configurations and bidirectional data transmission, enhancing system connectivity.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables a compact and slim profile, suitable for space-constrained applications or densely populated PCBs.

Width: 5.5 mm

The narrow width of 5.5mm contributes to efficient use of board space and facilitates compact system designs.

Output Polarity: TRUE

Having a true output polarity simplifies signal interpretation and ensures compatibility with standard logic levels, reducing configuration complexity.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V allows for operation in low-power scenarios, extending battery life and energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum reflow time of 30 seconds ensures proper soldering of the component during assembly, preventing overheating or damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C supports reliable and robust soldering processes, ensuring component integrity under thermal stress.

Length: 8 mm

The compact length of 8mm contributes to a space-saving design and allows for versatile placement within the circuit layout.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in a wide range of temperature conditions, making the product suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing overall performance.

Terminal Form: BALL

The ball terminal form simplifies soldering and improves thermal conductivity for efficient heat dissipation, ensuring reliable electrical connections.

Packing Method: TR

The TR packing method offers convenient handling, storage, and transportation of the components, ensuring protection against ESD and physical damage.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm enables high-density mounting and precise alignment on the PCB, enhancing overall system performance and reliability.

Count Direction: BIDIRECTIONAL

The bidirectional count direction allows for versatile data transmission in both forward and reverse directions, enhancing system flexibility and compatibility.

Control Type: COMMON CONTROL

The common control interface simplifies system integration and operation, allowing for centralized control and management of multiple functions.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage rating of 3.6V ensures compatibility with a wide range of power sources and provides flexibility in system design.

Maximum Power Supply Current (ICC): 0.02 mA

The low maximum power supply current consumption of 0.02mA results in energy-efficient operation and minimal power dissipation, extending battery life.

Technical Specifications

Bus Driver & Transceivers 74LVCHR16245AZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

74LVCHR16245AZRDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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