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74LVCHR16245AZQLR

Texas Instruments

74LVCHR16245AZQLR by Texas Instruments

74LVCHR16245AZQLR by Texas Instruments is a bus driver & transceiver with 8 bits and 2 functions. It operates at a nominal voltage of 1.8V and has a propagation delay of 4.8ns, making it ideal for industrial applications requiring bidirectional control with common control features.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45 parts In-Stock

1+ parts

$1.150

100+ parts

$1.130

1k+ parts

$1.100

10k+ parts

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45

$1.150

$1.130

$1.100

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Distributors (In-Stock)

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Vyrian

USA . 2,945 parts In-Stock

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2,945

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Bristol Electronics

USA . 934 parts In-Stock

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934

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Digiode

USA . 703 parts In-Stock

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703

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Distributors (Availability)

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Parana Technologies

USA . 431 parts In-Stock

1+ parts

$7.588

100+ parts

-

1k+ parts

$8.101

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431

$7.588

-

$8.101

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ChromeModa Solutions

Germany . 3,194 parts In-Stock

1+ parts

$8.526

100+ parts

$6.991

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3,194

$8.526

$6.991

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IDEA Electronic Components Group

UK . 467 parts In-Stock

1+ parts

$8.526

100+ parts

$8.100

1k+ parts

$7.673

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467

$8.526

$8.100

$7.673

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AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$12.709

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591

$12.709

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One Stop Electronics

USA . 131 parts In-Stock

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$15.000

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131

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Component Stockers USA

USA . 400 parts In-Stock

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$99.990

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400

$99.990

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Andel Nordic

Denmark . 427 parts In-Stock

1+ parts

$149.373

100+ parts

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$143.398

10k+ parts

$143.398

427

$149.373

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$143.398

$143.398

Assy Fe

Spain . 7,800 parts In-Stock

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7,800

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Corphita

USA . 4,277 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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DigiPath Technology Company

USA . 1,458 parts In-Stock

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$7.687

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1,458

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$7.687

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Microchip USA

USA . 401 parts In-Stock

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401

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Northwest PG Solutions

USA . 370 parts In-Stock

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370

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Native Components

USA . 42 parts In-Stock

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42

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Overview

Elevate your electronic designs with the Texas Instruments 74LVCHR16245AZQLR bus driver & transceiver. Crafted with precision by a trusted manufacturer, this versatile component offers unparalleled performance and reliability. Whether you're working on automotive systems, industrial machinery, or consumer electronics, this product delivers seamless signal transmission and efficient power management. Experience the value of cutting-edge technology and streamline your projects with the 74LVCHR16245AZQLR - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 4.8 ns

Low propagation delay ensures high-speed data transmission, making it suitable for bus driver applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, saving space and costs.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Technical Specifications

Bus Driver & Transceivers 74LVCHR16245AZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.5 mm

Trade Compliance

74LVCHR16245AZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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