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74LVCE161284DGGRE4

Texas Instruments

74LVCE161284DGGRE4 by Texas Instruments

74LVCE161284DGGRE4 by Texas Instruments is a Line Transceiver with 14 driver bits and 13 receiver bits. It operates at a supply voltage range of 3V to 3.6V, with max transmit delay of 30ns and receive delay of 18ns. This IC is commonly used in IEEE-1284 interface applications due to its small outline package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,143 parts In-Stock

1+ parts

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5,143

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Digiode

USA . 791 parts In-Stock

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791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 526 parts In-Stock

1+ parts

$3.868

100+ parts

-

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$4.352

10k+ parts

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526

$3.868

-

$4.352

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DigiPath Technology Company

USA . 184 parts In-Stock

1+ parts

$4.259

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184

$4.259

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ChromeModa Solutions

Germany . 4,284 parts In-Stock

1+ parts

$4.346

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$3.564

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4,284

$4.346

$3.564

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IDEA Electronic Components Group

UK . 1,911 parts In-Stock

1+ parts

$4.346

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$3.911

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1,911

$4.346

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$3.911

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AZTECH Wire

Italy . 396 parts In-Stock

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$19.848

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396

$19.848

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One Stop Electronics

USA . 404 parts In-Stock

1+ parts

$29.500

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404

$29.500

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Corphita

USA . 3,990 parts In-Stock

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3,990

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Northwest PG Solutions

USA . 2,146 parts In-Stock

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2,146

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Native Components

USA . 792 parts In-Stock

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792

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Overview

Enhance your electronic designs with the 74LVCE161284DGGRE4 by Texas Instruments, a top-quality line driver & receiver perfect for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust in the reliability and performance of this product. Offering fast transmit and receive delays, dual terminal positions, and compatibility with IEEE-1284 standards, this device ensures seamless data transfer in your projects. Experience the value and benefits of Texas Instruments technology with this cutting-edge component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver & receiver, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and making installation more efficient.

Maximum Supply Voltage: 3.6 V

Provides a wide operating range, allowing the product to be compatible with various systems and power sources.

No. of Functions: 13

Offers multiple functions in a single component, making it versatile and cost-effective for different applications.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments, ensuring reliable performance in various conditions.

Maximum Operating Temperature: 70 °C

Capable of withstanding high temperatures, making it suitable for use in industrial or harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring stable signal transmission over time.

Receiver No. of Bits: 13

Offers high resolution for data reception, allowing for accurate and reliable communication between devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during assembly, reducing production time and costs.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level, ensuring compatibility with common power sources and systems.

Technical Specifications

Line Drivers & Receivers 74LVCE161284DGGRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

14

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE-1284

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

13

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

18 ns

Receiver No. of Bits:

13

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

30 ns

Width:

6.1 mm

Trade Compliance

74LVCE161284DGGRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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