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74LVX161284MEAX

Onsemi

74LVX161284MEAX by Onsemi

74LVX161284MEAX by Onsemi is a CMOS Line Transceiver with 14-bit driver and 13-bit receiver. It operates at industrial temperature range (-40 to 85 °C) with a supply voltage of 3.3 V, suitable for IEEE 1284 interface applications requiring fast transmit/receive delays of up to 44 ns.

Median Price

$17.009

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$17.009

100+ parts

$15.478

1k+ parts

$13.947

10k+ parts

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3,000

$17.009

$15.478

$13.947

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Distributors (In-Stock)

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Freelance Electronics

USA . 263 parts In-Stock

1+ parts

$0.909

100+ parts

$0.954

1k+ parts

$0.899

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263

$0.909

$0.954

$0.899

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DF Sales Co.

USA . 1,620 parts In-Stock

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$1.400

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$1.400

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DF Sales Co.

USA . 1,620 parts In-Stock

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$1.400

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$1.400

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Digiode

USA . 1,892 parts In-Stock

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$16.159

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Vyrian

USA . 3,118 parts In-Stock

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Anansix

USA . 2,090 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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Bristol Electronics

USA . 1,000 parts In-Stock

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1,000

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Dan-Mar Components

USA . 1,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 369 parts In-Stock

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R&J Components

USA . 366 parts In-Stock

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Electronic Expediters

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 124 parts In-Stock

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$0.909

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124

$0.909

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Northwest PG Solutions

USA . 1,372 parts In-Stock

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$2.519

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$2.519

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Corphita

USA . 2,470 parts In-Stock

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$15.308

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2,470

$15.308

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$17.009

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$15.478

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$13.947

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3,000

$17.009

$15.478

$13.947

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Component Stockers USA

USA . 484 parts In-Stock

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$99.990

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484

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TANS Electronics

Latvia . 6,274 parts In-Stock

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Microchip USA

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Kulean Microsystems

USA . 4,477 parts In-Stock

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SupplyDigital Components

Austria . 2,579 parts In-Stock

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Supply Digital

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Authorized Procurement Solutions

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Native Components

USA . 909 parts In-Stock

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909

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Problanco Electronics

Mexico . 698 parts In-Stock

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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Kepictronics

USA . 125 parts In-Stock

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Overview

Unleash the power of seamless communication with the 74LVX161284MEAX by Onsemi. Crafted with precision and expertise, this line driver and receiver offers unparalleled quality and reliability. From industrial automation to telecommunications, this versatile product is designed to meet all your connectivity needs. Experience the value of fast transmit and receive speeds, efficient power management, and robust performance in a compact package. Elevate your projects with Onsemi's cutting-edge technology and elevate your success with the 74LVX161284MEAX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the line driver & receiver, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making installation and assembly more efficient.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power input options, making this product compatible with a wider range of systems.

No. of Functions: 13

With 13 functions packed into one device, this line driver & receiver offers comprehensive capabilities for various communication and signal processing tasks.

Package Shape: RECTANGULAR

The rectangular package shape offers practicality in terms of space-saving and efficient design for fitting into electronic devices.

Maximum Transmit Delay: 44 ns

Low transmit delay ensures quick signal transmission, reducing latency and improving overall communication efficiency.

Maximum Supply Voltage-1: 5.5 V

A high maximum supply voltage variant provides compatibility with systems that require higher power inputs, offering versatility for various applications.

No. of Terminals: 48

With 48 terminals, this line driver & receiver can accommodate a wide range of connections and configurations, enhancing its versatility in integration.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style offers a compact form factor, suitable for space-constrained applications and easier PCB layout.

Minimum Supply Voltage-1: 3 V

Having a low minimum supply voltage requirement ensures compatibility with systems that operate with lower power inputs, widening the range of supported applications.

Technical Specifications

Line Drivers & Receivers 74LVX161284MEAX attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

14

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1284

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

15.875 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

13

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Receive Delay:

44 ns

Receiver No. of Bits:

13

Maximum Seated Height:

2.74 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

44 ns

Width:

7.495 mm

Trade Compliance

74LVX161284MEAX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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