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74LVCZ161284AGRG4

Texas Instruments

74LVCZ161284AGRG4 by Texas Instruments

74LVCZ161284AGRG4 by Texas Instruments is a Line Driver & Receiver with 13 functions, operating at a supply voltage range of 3V to 5.5V. It features a max transmit delay of 22ns and is ideal for applications requiring IEEE 1284 interface standard compatibility in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,231 parts In-Stock

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Digiode

USA . 3,867 parts In-Stock

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3,867

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VNN

France . 3,847 parts In-Stock

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3,847

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Corohmni

South Africa . 239 parts In-Stock

1+ parts

$3.378

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239

$3.378

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AZTECH Wire

Italy . 376 parts In-Stock

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$8.157

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376

$8.157

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Parana Technologies

USA . 61 parts In-Stock

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$8.519

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$9.175

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61

$8.519

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$9.175

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DigiPath Technology Company

USA . 1,234 parts In-Stock

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$9.381

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$9.381

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ChromeModa Solutions

Germany . 1,600 parts In-Stock

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$9.572

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$7.849

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$9.572

$7.849

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IDEA Electronic Components Group

UK . 327 parts In-Stock

1+ parts

$9.572

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$9.093

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$8.615

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327

$9.572

$9.093

$8.615

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Ampacity Inc.

Singapore . 799 parts In-Stock

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$15.500

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One Stop Electronics

USA . 962 parts In-Stock

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$21.500

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Argo Parts USA

USA . 4,490 parts In-Stock

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Continental Prestige Electronics

USA . 4,391 parts In-Stock

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Corphita

USA . 2,190 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Elevate your electronic design with the Texas Instruments 74LVCZ161284AGRG4, a top-of-the-line Line Driver & Receiver that sets the standard for quality and reliability in the industry. Designed with precision and expertise by Texas Instruments, this product offers unparalleled performance and versatility for a wide range of applications. From fast transmit and receive speeds to a durable package body material, this innovative device delivers exceptional value and benefits to customers looking to optimize their circuit designs. Trust Texas Instruments to provide you with cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the line driver and receiver, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of systems and power sources, increasing the versatility of this product.

No. of Functions: 13

With 13 functions integrated into one device, this line driver and receiver offer a comprehensive solution for various communication and signal processing needs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into circuit designs and ensures a compact form factor for space-constrained applications.

Maximum Transmit Delay: 22 ns

The low transmit delay ensures fast signal processing and communication, making this product suitable for high-speed data transmission applications.

Maximum Supply Voltage-1: 5.5 V

The high maximum supply voltage-1 allows for robust performance and protection against voltage spikes, enhancing the overall reliability of the product.

No. of Terminals: 48

With a high number of terminals, this line driver and receiver offer flexibility in connection options and support complex signal routing requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enables dense PCB layouts and minimizes board space usage, making it ideal for compact electronic devices.

Minimum Supply Voltage-1: 3 V

The low minimum supply voltage-1 ensures efficient power consumption and compatibility with low-power applications, increasing energy efficiency.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for operation in low-voltage environments, making this product versatile for a wide range of applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, enhancing the durability of this product.

Minimum Operating Temperature: 0 °C

The wide temperature range allows for operation in both extreme cold and hot conditions, making this product suitable for outdoor and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability in signal transmission.

Terminal Position: DUAL

The dual terminal position offers redundancy and flexibility in connection options, increasing the reliability and versatility of this product.

Maximum Seated Height: 1.2 mm

The low seated height allows for a compact design and slim profile, making this product suitable for space-constrained applications.

Width: 6.1 mm

The narrow width enables efficient PCB layout and space-saving integration, contributing to a streamlined design and reduced overall footprint.

Receiver No. of Bits: 13

With 13 bits for the receiver, this product offers high-resolution signal processing and accurate data transmission, ensuring reliable communication.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature allows for safe and effective soldering during assembly, ensuring proper connection of the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures compatibility with standard reflow soldering processes, simplifying manufacturing and assembly.

Length: 12.5 mm

The compact length facilitates easy integration into electronic systems and enables a space-efficient design, ideal for applications with size constraints.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making this product suitable for a wide range of commercial applications.

Maximum Receive Delay: 22 ns

The low receive delay ensures fast data reception and processing, enhancing the efficiency of signal transmission in real-time applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure attachment to the PCB and facilitates efficient soldering during assembly, ensuring robust mechanical connection.

Interface Standard: IEEE 1284

Compliance with the IEEE 1284 interface standard ensures compatibility with a wide range of devices and systems, enabling seamless communication and interoperability.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with common signal levels and protocols, making this product versatile for a variety of applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable power delivery and ensures consistent performance, making this product reliable for long-term use.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on PCBs and enables space-saving design, suitable for compact electronic devices.

Driver No. of Bits: 14

With 14 bits for the driver, this product offers high-resolution signal processing and precise output control, enhancing the accuracy and reliability of data transmission.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type enables bidirectional communication and signal conversion, making this product versatile for various interface applications.

Technical Specifications

Line Drivers & Receivers 74LVCZ161284AGRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

14

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE 1284

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

13

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

22 ns

Receiver No. of Bits:

13

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

22 ns

Width:

6.1 mm

Trade Compliance

74LVCZ161284AGRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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