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74LVC161284ATTR

STMicroelectronics

74LVC161284ATTR by STMicroelectronics

74LVC161284ATTR by STMicroelectronics is a CMOS line transceiver with an industrial temperature grade, supporting a max supply voltage of 5.5V and operating temp from -40 °C to 85 °C. It features 8-bit drivers/receivers with a max transmit delay of just 9ns. Ideal for high-speed data communication in compact applications, it comes in a thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,008 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,008

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Digiode

USA . 1,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,305

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Anansix

USA . 225 parts In-Stock

1+ parts

-

100+ parts

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225

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 102 parts In-Stock

1+ parts

$0.913

100+ parts

-

1k+ parts

-

10k+ parts

-

102

$0.913

-

-

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Northwest PG Solutions

USA . 776 parts In-Stock

1+ parts

$1.004

100+ parts

-

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10k+ parts

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776

$1.004

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IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$4.663

100+ parts

-

1k+ parts

$4.197

10k+ parts

-

1,391

$4.663

-

$4.197

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MKK Technologies

India . 2,046 parts In-Stock

1+ parts

$8.769

100+ parts

-

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10k+ parts

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2,046

$8.769

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DigiPath Technology Company

USA . 2,046 parts In-Stock

1+ parts

$8.769

100+ parts

-

1k+ parts

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10k+ parts

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2,046

$8.769

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-

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Corphita

USA . 4,247 parts In-Stock

1+ parts

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4,247

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Parana Technologies

USA . 453 parts In-Stock

1+ parts

-

100+ parts

$5.576

1k+ parts

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10k+ parts

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453

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$5.576

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Overview

Elevate your designs with the 74LVC161284ATTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance line driver/receiver ensures rapid signal transmission and exceptional reliability for industrial applications. Thriving in diverse environments from -40 °C to 85 °C, its compact design seamlessly fits into space-constrained projects, delivering unmatched efficiency and durability that empowers your next breakthrough.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal stability, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for compact design and easy integration into modern PCBs.

Maximum Supply Voltage: 3.6 V

This maximum supply voltage ensures compatibility with various low-power applications.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on circuit boards.

Maximum Transmit Delay: 9 ns

With a low transmit delay, this product supports high-speed data communication, enhancing performance.

Maximum Supply Voltage-1: 5.5 V

This higher supply voltage option offers flexibility for powering different systems.

No. of Terminals: 48

A high number of terminals allows for more functions and connections in a single package.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile design maximizes space efficiency and is ideal for compact electronics.

Minimum Supply Voltage-1: 3 V

This wide voltage range supports diverse applications while maintaining stability.

Minimum Supply Voltage: 3 V

Ensures compatibility with various low-power configurations, enhancing usability.

Maximum Operating Temperature: 85 °C

With a broad operating temperature range, this product is suitable for industrial environments.

Minimum Operating Temperature: -40 °C

This feature allows operation in extreme conditions, making it versatile for different applications.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and enhances connectivity options.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for space-saving designs in compact electronics.

Width: 6.1 mm

The compact width allows for the integration of multiple components in tight spaces.

Receiver No. of Bits: 8

An 8-bit receiver enables handling of significant data sizes for robust communication.

Length: 12.5 mm

Compact length aids in efficient space management for circuit designs.

Temperature Grade: INDUSTRIAL

Industrial-grade classification ensures reliability in harsh environments and long-lasting performance.

Maximum Receive Delay: 9 ns

Low receive delay supports high-speed data transmission, essential for demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and ease of assembly.

Interface Standard: IEEE 1284

Adherence to this standard ensures compatibility with a wide range of devices and systems.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity for robust communication.

Nominal Supply Voltage: 3.3 V

This nominal voltage is widely used in electronic devices, simplifying design and integration.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for a denser arrangement of connections without compromising performance.

Driver No. of Bits: 8

An 8-bit driver capability ensures efficient data processing for high-performance applications.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC enables reliable data transmission over long distances.

Technical Specifications

Line Drivers & Receivers 74LVC161284ATTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

8

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1284

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Receive Delay:

9 ns

Receiver No. of Bits:

8

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

9 ns

Width:

6.1 mm

Trade Compliance

74LVC161284ATTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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