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74LVC161284TTR

STMicroelectronics

74LVC161284TTR by STMicroelectronics

74LVC161284TTR by STMicroelectronics is a CMOS line transceiver with an industrial temperature grade, supporting supply voltages from 3V to 5.5V. It features a max transmit/receive delay of just 9 ns and comes in a compact 48-terminal package. Ideal for high-speed data communication applications, it ensures reliable performance in demanding environments.

Median Price

$3.450

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 191 parts In-Stock

1+ parts

$3.450

100+ parts

$2.147

1k+ parts

-

10k+ parts

$1.828

191

$3.450

$2.147

-

$1.828

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,708 parts In-Stock

1+ parts

$4.646

100+ parts

-

1k+ parts

-

10k+ parts

-

4,708

$4.646

-

-

-

Vyrian

USA . 8,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,543

-

-

-

-

Anansix

USA . 1,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,537

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,853 parts In-Stock

1+ parts

$4.401

100+ parts

-

1k+ parts

-

10k+ parts

-

2,853

$4.401

-

-

-

Microchip USA

USA . 206 parts In-Stock

1+ parts

$9.918

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$9.918

-

-

-

IDEA Electronic Components Group

UK . 920 parts In-Stock

1+ parts

$12.678

100+ parts

-

1k+ parts

$11.410

10k+ parts

-

920

$12.678

-

$11.410

-

MKK Technologies

India . 1,191 parts In-Stock

1+ parts

$23.839

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

$23.839

-

-

-

DigiPath Technology Company

USA . 1,191 parts In-Stock

1+ parts

$23.839

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

$23.839

-

-

-

Parana Technologies

USA . 2,129 parts In-Stock

1+ parts

-

100+ parts

$15.158

1k+ parts

-

10k+ parts

-

2,129

-

$15.158

-

-

Native Components

USA . 847 parts In-Stock

1+ parts

-

100+ parts

-

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847

-

-

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Northwest PG Solutions

USA . 515 parts In-Stock

1+ parts

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515

-

-

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Perfect Parts

USA . 442 parts In-Stock

1+ parts

-

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10k+ parts

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442

-

-

-

-

Overview

Unlock seamless connectivity and superior performance with the 74LVC161284TTR from STMicroelectronics. Renowned for its commitment to quality and innovation, STMicroelectronics delivers a robust line driver/receiver that excels in various applications, from industrial automation to consumer electronics. Enjoy crystal-clear data transmission with minimal delay, all while benefiting from an eco-friendly design. Elevate your projects with this reliable solution and experience the difference that excellence brings!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durability and resistance to environmental factors make this material ideal for robust applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and supports automated assembly.

Maximum Supply Voltage: 3.6 V

This voltage range provides flexibility for low-power applications, ensuring compatibility with a variety of designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout for PCB designs, facilitating higher packing density.

Maximum Transmit Delay: 9 ns

Low transmit delay allows for high-speed data transfer, making it suitable for time-sensitive applications.

Maximum Supply Voltage-1: 5.5 V

Allows for versatility in power supply design, accommodating various system voltages.

No. of Terminals: 48

A higher number of terminals supports extensive connectivity options, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile helps in designs where space is at a premium, crucial for compact electronic devices.

Minimum Supply Voltage-1: 3 V

Low minimum voltage enhances compatibility with battery-operated devices and reduces energy consumption.

Minimum Supply Voltage: 3 V

Stable performance at low voltages makes the product energy-efficient for portable applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher operational temperatures are a requirement.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme environments, such as outdoor applications.

Terminal Finish: Matte Tin (Sn) - annealed

This finish improves solderability and reduces risk of corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, simplifying integration into various circuits.

Maximum Seated Height: 1.2 mm

Low seated height ensures minimal space consumption on the PCB, allowing for compact designs.

Width: 6.1 mm

Compact width aids in high-density circuit designs without sacrificing soldering or thermal performance.

Receiver No. of Bits: 8

An 8-bit receiver enhances data handling capabilities for extensive communication protocols.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for effective soldering during manufacturing, ensuring a reliable component assembly.

Peak Reflow Temperature (°C): 260

The high reflow temperature range ensures compatibility with various soldering techniques.

Length: 12.5 mm

Compact length is advantageous in designs requiring high performance in a limited space.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for reliability in harsh conditions, ideal for demanding applications.

Maximum Receive Delay: 9 ns

Fast receive delay supports high-speed communication, essential for modern digital systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it perfect for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, enhancing manufacturing efficiency.

Interface Standard: IEEE 1284

Compliance with this standard ensures compatibility with a wide range of devices and systems.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger inputs provide excellent noise immunity and precise signal transitions, enhancing reliability.

Nominal Supply Voltage: 3.3 V

The nominal voltage aligns with modern logic levels, promoting compatibility with contemporary electronics.

Terminal Pitch: 0.5 mm

A finer terminal pitch supports tighter layouts, essential for high-density boards.

Driver No. of Bits: 8

An 8-bit driver enhances the capability to transmit more data simultaneously, improving overall efficiency.

Moisture Sensitivity Level (MSL): 3

Level 3 indicates moderate sensitivity, requiring proper handling but ensuring reasonable reliability.

Interface IC Type: LINE TRANSCEIVER

Designed for line communication, making it an excellent choice for data transfer applications.

Technical Specifications

Line Drivers & Receivers 74LVC161284TTR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

8

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1284

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

9 ns

Receiver No. of Bits:

8

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

9 ns

Width:

6.1 mm

Trade Compliance

74LVC161284TTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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