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74FCT16240ATPVCTG4

Texas Instruments

74FCT16240ATPVCTG4 by Texas Instruments

74FCT16240ATPVCTG4 by Texas Instruments is a bus driver with 4 functions, operating at a supply voltage of 5V. It features a propagation delay of 4.8ns and output characteristics in the form of 3-STATE. This CMOS technology device is ideal for industrial applications requiring fast signal transmission over short distances.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,316 parts In-Stock

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Digiode

USA . 4,106 parts In-Stock

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4,106

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Distributors (Availability)

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Native Components

USA . 317 parts In-Stock

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$6.700

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317

$6.700

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Andel Nordic

Denmark . 599 parts In-Stock

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$7.334

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$7.041

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$7.041

599

$7.334

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$7.041

$7.041

AZTECH Wire

Italy . 801 parts In-Stock

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$10.454

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801

$10.454

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Parana Technologies

USA . 654 parts In-Stock

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$28.773

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$51.705

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654

$28.773

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$51.705

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DigiPath Technology Company

USA . 1,547 parts In-Stock

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$31.682

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1,547

$31.682

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ChromeModa Solutions

Germany . 3,025 parts In-Stock

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$32.329

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$26.510

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$32.329

$26.510

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IDEA Electronic Components Group

UK . 1,527 parts In-Stock

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$32.329

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$30.713

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$29.096

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One Stop Electronics

USA . 1,273 parts In-Stock

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$49.000

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Corphita

USA . 4,517 parts In-Stock

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Microchip USA

USA . 2,234 parts In-Stock

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Northwest PG Solutions

USA . 183 parts In-Stock

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Overview

Unlock seamless data transmission and enhance your electronic designs with the 74FCT16240ATPVCTG4 by Texas Instruments. Manufactured with top-notch quality and precision, this bus driver and transceiver offers unparalleled performance and reliability. Perfect for a wide range of applications, this product provides efficient signal routing and control, ensuring optimal functionality for your projects. Experience the value and benefits of Texas Instruments' expertise in semiconductor technology with the 74FCT16240ATPVCTG4. Elevate your designs to the next level with this exceptional component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and robustness to the product, ensuring it can withstand rough handling and harsh environments.

Propagation Delay At Nominal Supply: 4.8 ns

The low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, saving time and effort during the assembly process.

No. of Functions: 4

With multiple functions in one device, this product offers versatility and flexibility in its applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into existing systems or circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable performance and reliability of the product.

No. of Terminals: 48

Having a high number of terminals allows for multiple connections and a wide range of input and output options.

Output Characteristics: 3-STATE

The 3-STATE output feature provides flexibility in controlling the output signal, enhancing the product's functionality.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement allows for operation even in low power conditions, increasing the product's versatility.

Technical Specifications

Bus Driver & Transceivers 74FCT16240ATPVCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

74FCT16240ATPVCTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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