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74CBT16209ADGGRG4

Texas Instruments

74CBT16209ADGGRG4 by Texas Instruments

74CBT16209ADGGRG4 by Texas Instruments is a bus driver & transceiver with 9 bits, 0.35 ns propagation delay, and 3-state output. It operates at a supply voltage of 5V and can handle load capacitance of 50 pF. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,764 parts In-Stock

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Vyrian

USA . 4,215 parts In-Stock

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Semi Source

USA . 557 parts In-Stock

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557

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Distributors (Availability)

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Native Components

USA . 558 parts In-Stock

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$0.152

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$0.146

558

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$0.146

Northwest PG Solutions

USA . 2,202 parts In-Stock

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$0.168

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$0.148

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$0.168

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$0.148

Andel Nordic

Denmark . 508 parts In-Stock

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$6.471

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$6.212

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$6.212

508

$6.471

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$6.212

$6.212

AZTECH Wire

Italy . 647 parts In-Stock

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$16.408

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647

$16.408

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Parana Technologies

USA . 1,688 parts In-Stock

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$16.467

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$16.760

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1,688

$16.467

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$16.760

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DigiPath Technology Company

USA . 1,191 parts In-Stock

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$18.132

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$18.132

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ChromeModa Solutions

Germany . 374 parts In-Stock

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$18.502

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$15.172

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374

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$15.172

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IDEA Electronic Components Group

UK . 357 parts In-Stock

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$18.502

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$17.577

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$16.652

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357

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$16.652

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One Stop Electronics

USA . 1,571 parts In-Stock

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$39.000

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$39.000

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Corphita

USA . 873 parts In-Stock

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Microchip USA

USA . 369 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality 74CBT16209ADGGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and reliability in their products. This bus driver & transceiver is perfect for a wide range of applications, offering seamless connectivity and efficient data transmission. With its cutting-edge technology and innovative design, this product provides exceptional value and benefits to customers looking for superior components for their projects. Choose Texas Instruments for unparalleled quality and performance in your electronic solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one product offers versatility and efficiency in circuit design and operation.

Nominal Supply Voltage / Vsup (V): 5

Having a standard supply voltage of 5V simplifies power management and compatibility with other components in the system.

Propagation Delay (tpd): 0.35 ns

The low propagation delay ensures fast signal transmission and response times, critical for high-speed communication applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product is suitable for industrial environments that may experience elevated temperatures.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a reliable choice for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers 74CBT16209ADGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE BUS SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

2

No. of Ports:

4

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

74CBT16209ADGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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