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74AVCA164245GRE4

Texas Instruments

74AVCA164245GRE4 by Texas Instruments

74AVCA164245GRE4 by Texas Instruments is a bus driver & transceiver with 8 bits, operating at 1.5/3.3V. It features a propagation delay of 6.8 ns, outputting in true polarity with a max I (ol) of 12 Amps. This industrial-grade component is ideal for bidirectional applications requiring common control functions and operates within -40 to 85°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,965 parts In-Stock

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3,965

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Digiode

USA . 3,752 parts In-Stock

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3,752

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Netsource Technology, Inc.

USA . 837 parts In-Stock

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837

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Distributors (Availability)

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Andel Nordic

Denmark . 455 parts In-Stock

1+ parts

$7.825

100+ parts

-

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$7.512

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$7.512

455

$7.825

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$7.512

$7.512

AZTECH Wire

Italy . 336 parts In-Stock

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$12.844

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336

$12.844

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Parana Technologies

USA . 1,700 parts In-Stock

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$27.765

100+ parts

$2,578.432

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$24.989

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1,700

$27.765

$2,578.432

$24.989

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DigiPath Technology Company

USA . 321 parts In-Stock

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$30.573

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321

$30.573

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ChromeModa Solutions

Germany . 3,477 parts In-Stock

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$31.197

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$25.582

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3,477

$31.197

$25.582

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IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$31.197

100+ parts

$29.637

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$28.077

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1,385

$31.197

$29.637

$28.077

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One Stop Electronics

USA . 619 parts In-Stock

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$39.000

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619

$39.000

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QUARKTWIN TECHNOLOGY LTD

USA . 3,391 parts In-Stock

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Microchip USA

USA . 2,134 parts In-Stock

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Northwest PG Solutions

USA . 1,281 parts In-Stock

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Corphita

USA . 1,164 parts In-Stock

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Native Components

USA . 216 parts In-Stock

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Metaverse IC Inc.

Canada . 130 parts In-Stock

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ChipstoGo Electronic ltd

UK . 30 parts In-Stock

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30

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Overview

Unlock seamless data transmission with the Texas Instruments 74AVCA164245GRE4 Bus Driver & Transceivers. Crafted with precision and expertise, Texas Instruments delivers unmatched quality and reliability. Ideal for a range of applications, this product ensures high-speed data transfer with minimal delay. Experience the value of efficient performance and seamless connectivity with the 74AVCA164245GRE4, providing customers with the perfect solution for their communication needs. Elevate your projects with this cutting-edge technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material provides durability and protection for the internal components of the bus driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay allows for fast signal transmission within the bus driver, resulting in efficient communication between devices.

Surface Mount: YES

Surface mount capability makes installation easy and efficient, saving time during manufacturing processes.

No. of Functions: 2

Having multiple functions in a single device simplifies circuit design and reduces component count, leading to cost savings and space efficiency.

Package Shape: RECTANGULAR

Rectangular package shape enables easy integration into circuit boards, optimizing space utilization and ensuring a neat layout.

No. of Bits: 8

8-bit capability allows for handling larger data packets, making the bus driver suitable for applications requiring higher data processing capacities.

Translation: 1.5/3.3V&1.5/3.3V

Support for multiple voltage translation options enables compatibility with various devices, enhancing flexibility in system design.

Nominal Supply Voltage / Vsup (V): 1.5

Stable supply voltage ensures consistent performance of the bus driver under different operating conditions.

Load Capacitance (CL): 15 pF

Optimal load capacitance allows for efficient signal transmission and reception, ensuring reliable communication between devices.

Power Supplies (V): 1.5/3.3

Support for multiple power supply voltages offers compatibility with a wide range of devices, making the bus driver versatile in various applications.

Technical Specifications

Bus Driver & Transceivers 74AVCA164245GRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

6.1 mm

Trade Compliance

74AVCA164245GRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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