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74ALVCH16244ZRDR

Texas Instruments

74ALVCH16244ZRDR by Texas Instruments

74ALVCH16244ZRDR by Texas Instruments is a CMOS bus driver with 4 functions, 3.7 ns propagation delay, and 24 Amp max I (ol). It operates at a supply voltage of 1.8V to 3.6V and is ideal for industrial applications requiring fast signal transmission in a compact package style.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Digiode

USA . 3,947 parts In-Stock

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Chip Stock

USA . 3,511 parts In-Stock

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Vyrian

USA . 3,499 parts In-Stock

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Sea View Technologies

USA . 613 parts In-Stock

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Bristol Electronics

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Native Components

USA . 486 parts In-Stock

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$1.470

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Northwest PG Solutions

USA . 998 parts In-Stock

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Andel Nordic

Denmark . 305 parts In-Stock

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$6.694

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$6.426

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Parana Technologies

USA . 640 parts In-Stock

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$10.283

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DigiPath Technology Company

USA . 87 parts In-Stock

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$11.323

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ChromeModa Solutions

Germany . 5,567 parts In-Stock

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IDEA Electronic Components Group

UK . 955 parts In-Stock

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$10.399

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AZTECH Wire

Italy . 289 parts In-Stock

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One Stop Electronics

USA . 1,590 parts In-Stock

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Perfect Parts

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Corphita

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Authorized Procurement Solutions

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ChipstoGo Electronic ltd

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Microchip USA

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Overview

Elevate your electronic designs with the 74ALVCH16244ZRDR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that are essential for seamless data transmission in various applications. With a focus on reliability and performance, this product stands out with its fast propagation delay and low power consumption. Whether you're working on industrial automation or telecommunications systems, this product offers unmatched value with its advanced features and innovative design. Upgrade your projects today with the 74ALVCH16244ZRDR and experience excellence in every connection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 3 ns

Ensures fast signal transmission within the device, leading to efficient operation.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Offers multiple functions in a single component, reducing the need for additional parts.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, making it energy-efficient.

Output Characteristics: 3-STATE

Enables the device to drive the output pins to a high impedance state, enhancing flexibility in signal routing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it suitable for various applications.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16244ZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

74ALVCH16244ZRDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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