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74ALVCH162373ZQLR

Texas Instruments

74ALVCH162373ZQLR by Texas Instruments

The Texas Instruments 74ALVCH162373ZQLR is a bus driver with 8 bits, 2 functions, and a propagation delay of 4 ns. It operates at a nominal voltage of 1.8V and has a max operating temperature of 85°C. This IC is ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,445 parts In-Stock

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3,445

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Digiode

USA . 154 parts In-Stock

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154

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Distributors (Availability)

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Andel Nordic

Denmark . 494 parts In-Stock

1+ parts

$5.027

100+ parts

-

1k+ parts

$4.826

10k+ parts

$4.826

494

$5.027

-

$4.826

$4.826

AZTECH Wire

Italy . 777 parts In-Stock

1+ parts

$11.507

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777

$11.507

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Parana Technologies

USA . 367 parts In-Stock

1+ parts

$23.037

100+ parts

-

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$23.679

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367

$23.037

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$23.679

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DigiPath Technology Company

USA . 1,663 parts In-Stock

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$25.366

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1,663

$25.366

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ChromeModa Solutions

Germany . 6,851 parts In-Stock

1+ parts

$25.884

100+ parts

$21.225

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6,851

$25.884

$21.225

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IDEA Electronic Components Group

UK . 569 parts In-Stock

1+ parts

$25.884

100+ parts

$24.590

1k+ parts

$23.296

10k+ parts

-

569

$25.884

$24.590

$23.296

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One Stop Electronics

USA . 203 parts In-Stock

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$64.000

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203

$64.000

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Component Stockers USA

USA . 491 parts In-Stock

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$99.990

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491

$99.990

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Kepictronics

USA . 10,000 parts In-Stock

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Microchip USA

USA . 4,098 parts In-Stock

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4,098

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Glotronic Ltd.

UK . 3,000 parts In-Stock

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Northwest PG Solutions

USA . 1,160 parts In-Stock

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Native Components

USA . 655 parts In-Stock

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655

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Corphita

USA . 117 parts In-Stock

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117

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Overview

Unlock seamless data transmission with the Texas Instruments 74ALVCH162373ZQLR Bus Driver & Transceivers, designed for industrial-grade applications. With a reputation for excellence, Texas Instruments delivers unmatched quality and reliability in every product. This versatile chip offers customers exceptional value, providing fast propagation delays and low power consumption for efficient performance. Ideal for a wide range of electronic devices, trust Texas Instruments to elevate your connectivity solutions with the 74ALVCH162373ZQLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in transportation vehicles.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space in electronic assemblies.

No. of Functions: 2

Having multiple functions in a single component saves board space and simplifies circuit design.

Nominal Supply Voltage/Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in reducing power consumption, making it energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions and ensure reliable performance.

Technical Specifications

Bus Driver & Transceivers 74ALVCH162373ZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.5 mm

Trade Compliance

74ALVCH162373ZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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