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74ALVC162831DBBRE4

Texas Instruments

74ALVC162831DBBRE4 by Texas Instruments

74ALVC162831DBBRE4 by Texas Instruments is a 9-bit bus driver with 3.3V power supply, 5.3ns propagation delay, and operates in industrial temperature range. It is used for driving buses in various applications requiring true output polarity and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,096 parts In-Stock

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8,096

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Digiode

USA . 1,771 parts In-Stock

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1,771

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Distributors (Availability)

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Native Components

USA . 49 parts In-Stock

1+ parts

$0.150

100+ parts

-

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$0.144

49

$0.150

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$0.144

Northwest PG Solutions

USA . 408 parts In-Stock

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$0.165

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-

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$0.146

408

$0.165

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$0.146

AZTECH Wire

Italy . 267 parts In-Stock

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$6.997

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267

$6.997

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Parana Technologies

USA . 563 parts In-Stock

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$24.910

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$25.605

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563

$24.910

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$25.605

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DigiPath Technology Company

USA . 1,317 parts In-Stock

1+ parts

$27.429

100+ parts

$25.235

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1,317

$27.429

$25.235

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ChromeModa Solutions

Germany . 6,627 parts In-Stock

1+ parts

$27.989

100+ parts

$22.951

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6,627

$27.989

$22.951

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IDEA Electronic Components Group

UK . 35 parts In-Stock

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$27.989

100+ parts

$26.590

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$25.190

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35

$27.989

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$25.190

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One Stop Electronics

USA . 677 parts In-Stock

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$52.000

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$52.000

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Corphita

USA . 575 parts In-Stock

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575

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Microchip USA

USA . 278 parts In-Stock

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Overview

Enhance your designs with the high-quality 74ALVC162831DBBRE4 bus driver & transceiver from Texas Instruments. With a focus on innovation and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This versatile component offers customers exceptional value, benefits, and advantages, making it the ideal choice for your next project. Upgrade your design today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and improving overall design efficiency.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V can help save power and increase energy efficiency in electronic systems.

Propagation Delay (tpd): 5.3 ns

With a fast propagation delay of 5.3 ns, this product ensures quick signal transmission, which is crucial for high-speed data communication.

Temperature Grade: INDUSTRIAL

The industrial temperature grade means this product can operate reliably in a wide range of temperatures, making it suitable for harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers 74ALVC162831DBBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G80

Length:

17 mm

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP80,.3,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

74ALVC162831DBBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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