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74AHCT1G125DCKTE4

Texas Instruments

74AHCT1G125DCKTE4 by Texas Instruments

74AHCT1G125DCKTE4 by Texas Instruments is a CMOS bus driver with 8.5 ns propagation delay at 5V, suitable for automotive applications. It features a 3-STATE output and can handle up to 8A of current, making it ideal for driving buses and transceivers in compact designs. With a small outline package and dual terminals, this device offers efficient signal transmission in tight spaces.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 86 parts In-Stock

1+ parts

$1.950

100+ parts

$0.921

1k+ parts

$0.522

10k+ parts

$0.479

86

$1.950

$0.921

$0.522

$0.479

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$0.459

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$0.459

-

-

-

Digiode

USA . 1,235 parts In-Stock

1+ parts

$0.922

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$0.922

-

-

-

Vyrian

USA . 2,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,733

-

-

-

-

VNN

France . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

$0.432

10k+ parts

-

1,000

$0.450

-

$0.432

-

Corphita

USA . 2,800 parts In-Stock

1+ parts

$0.873

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

$0.873

-

-

-

Ampacity Inc.

Singapore . 127 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

127

$1.400

-

-

-

Andel Nordic

Denmark . 35 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

$2.026

10k+ parts

$2.026

35

$2.110

-

$2.026

$2.026

AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$13.323

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$13.323

-

-

-

Parana Technologies

USA . 811 parts In-Stock

1+ parts

$16.503

100+ parts

-

1k+ parts

$16.788

10k+ parts

-

811

$16.503

-

$16.788

-

DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

$18.172

100+ parts

$16.718

1k+ parts

-

10k+ parts

-

2,057

$18.172

$16.718

-

-

ChromeModa Solutions

Germany . 3,152 parts In-Stock

1+ parts

$18.543

100+ parts

$15.205

1k+ parts

-

10k+ parts

-

3,152

$18.543

$15.205

-

-

IDEA Electronic Components Group

UK . 1,027 parts In-Stock

1+ parts

$18.543

100+ parts

$17.616

1k+ parts

$16.689

10k+ parts

-

1,027

$18.543

$17.616

$16.689

-

Microchip USA

USA . 2,442 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,442

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Overview

Experience seamless and reliable data transmission with the 74AHCT1G125DCKTE4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. As a leading product in the Bus Driver & Transceivers category, this versatile component offers unrivaled quality and precision in a compact package. Ideal for automotive applications, this device boasts a fast propagation delay of 8.5 ns and low power consumption, ensuring optimal performance in any setting. Trust in Texas Instruments to deliver superior solutions that elevate your projects to new heights. Elevate your design with the 74AHCT1G125DCKTE4 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for use in automotive applications where weight is a factor.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast response time, making this product suitable for high-speed bus communication.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes integration with other components easier and more convenient.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for tristate control, increasing flexibility and enabling multiple devices to share the same bus line.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, ensuring reliable operation in harsh environments.

Technical Specifications

Bus Driver & Transceivers 74AHCT1G125DCKTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

74AHCT1G125DCKTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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