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74AHCT16244DGVRE4

Texas Instruments

74AHCT16244DGVRE4 by Texas Instruments

74AHCT16244DGVRE4 by Texas Instruments is a 48-terminal bus driver with 10.5 ns propagation delay at 5V, suitable for automotive applications. It features a small outline package, true output polarity, and dual terminal position for efficient signal transmission in electronic systems. With a max operating temperature of 125°C and low power supply current of 0.04 mA, it ensures reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,237 parts In-Stock

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Digiode

USA . 4,334 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 84 parts In-Stock

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$7.284

100+ parts

-

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$6.992

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$6.992

84

$7.284

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$6.992

$6.992

One Stop Electronics

USA . 683 parts In-Stock

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$12.000

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683

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AZTECH Wire

Italy . 835 parts In-Stock

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$18.948

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Parana Technologies

USA . 1,342 parts In-Stock

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$19.886

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$19.841

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1,342

$19.886

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$19.841

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DigiPath Technology Company

USA . 568 parts In-Stock

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$21.897

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$20.145

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568

$21.897

$20.145

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ChromeModa Solutions

Germany . 6,010 parts In-Stock

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$22.344

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$18.322

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$22.344

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

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$22.344

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$21.227

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$20.110

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2,070

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Northwest PG Solutions

USA . 1,321 parts In-Stock

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Microchip USA

USA . 1,093 parts In-Stock

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Native Components

USA . 979 parts In-Stock

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Corphita

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Overview

Upgrade your electronic designs with the 74AHCT16244DGVRE4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver component offers exceptional performance and versatility, making it ideal for a wide range of applications. With fast propagation delays and a compact package body material, this product provides value and efficiency to your projects. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to impact, making the product suitable for rugged environments such as automotive applications.

Propagation Delay At Nominal Supply: 10.5 ns

Fast propagation delay ensures quick signal transmission, which is crucial in bus driver applications where timing is critical.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying the assembly process.

No. of Functions: 4

Multiple functions integrated into one component reduce the overall component count and complexity of the system.

No. of Terminals: 48

Provides ample connectivity options for interfacing with other components in the system, enhancing versatility.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Temperature Grade: AUTOMOTIVE

Designed to operate in automotive temperature ranges, ensuring reliable performance in harsh conditions.

Technical Specifications

Bus Driver & Transceivers 74AHCT16244DGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

74AHCT16244DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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