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74AHC1G126DBVTG4

Texas Instruments

74AHC1G126DBVTG4 by Texas Instruments

74AHC1G126DBVTG4 by Texas Instruments is a bus driver & transceiver with a propagation delay of 8.5 ns and a load capacitance of 50 pF. It is commonly used in automotive applications due to its small size and low power consumption.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 250 parts In-Stock

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$0.440

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250

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$0.440

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.281

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$0.281

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Digiode

USA . 4,134 parts In-Stock

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VNN

France . 864 parts In-Stock

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Vyrian

USA . 184 parts In-Stock

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184

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Distributors (Availability)

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Argo Parts USA

USA . 4,029 parts In-Stock

1+ parts

$0.281

100+ parts

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$0.273

4,029

$0.281

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$0.273

Continental Prestige Electronics

USA . 3,419 parts In-Stock

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$0.281

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$0.275

3,419

$0.281

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$0.275

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.281

100+ parts

-

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$0.267

10k+ parts

$0.261

500

$0.281

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$0.267

$0.261

Ampacity Inc.

Singapore . 250 parts In-Stock

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$0.374

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$0.374

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Andel Nordic

Denmark . 68 parts In-Stock

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$4.665

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$4.479

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$4.479

68

$4.665

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$4.479

AZTECH Wire

Italy . 450 parts In-Stock

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$8.318

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$8.318

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Parana Technologies

USA . 353 parts In-Stock

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$16.097

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$16.426

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353

$16.097

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$16.426

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DigiPath Technology Company

USA . 2,365 parts In-Stock

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$17.724

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$16.306

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$17.724

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ChromeModa Solutions

Germany . 6,918 parts In-Stock

1+ parts

$18.086

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$14.831

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6,918

$18.086

$14.831

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IDEA Electronic Components Group

UK . 1,775 parts In-Stock

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$18.086

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$17.182

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$16.277

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1,775

$18.086

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Corphita

USA . 2,922 parts In-Stock

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Microchip USA

USA . 1,895 parts In-Stock

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Overview

Experience the unbeatable quality and reliability of the 74AHC1G126DBVTG4 by Texas Instruments, a leading manufacturer in the industry. As a bus driver and transceiver, this versatile product offers seamless communication between devices. Its small outline, low profile package shape and shrink pitch make it suitable for various applications. With a true output polarity and 3-state output characteristics, the 74AHC1G126DBVTG4 provides exceptional value and benefits to customers. Trust in Texas Instruments and elevate your projects with this high-performance solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for use in automotive applications.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast and efficient communication within the system.

Surface Mount: YES

Surface mount packaging allows for easy and compact assembly onto circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage, ensuring compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

The load capacitance is optimized for efficient signal transmission and reception.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for automotive environments.

Output Characteristics: 3-STATE

3-state output allows for multiple devices to share the same bus without interference.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for bus driver applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections for secure mounting on the PCB.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in harsh conditions.

Technical Specifications

Bus Driver & Transceivers 74AHC1G126DBVTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.6 mm

Trade Compliance

74AHC1G126DBVTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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