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74ACT11898N

Texas Instruments

74ACT11898N by Texas Instruments

74ACT11898N by Texas Instruments is a 10-bit digital shift register with a propagation delay of 10.6 ns and operates at a supply voltage of 5V. It is commonly used in industrial applications requiring true output polarity, such as data communication systems or control units.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,450 parts In-Stock

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9,450

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Digiode

USA . 2,108 parts In-Stock

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2,108

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Distributors (Availability)

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AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$5.647

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594

$5.647

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One Stop Electronics

USA . 411 parts In-Stock

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$24.000

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411

$24.000

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Parana Technologies

USA . 1,556 parts In-Stock

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$24.768

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$25.438

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1,556

$24.768

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$25.438

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DigiPath Technology Company

USA . 2,257 parts In-Stock

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$27.272

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2,257

$27.272

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ChromeModa Solutions

Germany . 3,701 parts In-Stock

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$27.829

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$22.820

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3,701

$27.829

$22.820

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$27.829

100+ parts

$26.438

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$25.046

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1,473

$27.829

$26.438

$25.046

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Native Components

USA . 337 parts In-Stock

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$59.002

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$56.642

337

$59.002

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$56.642

Northwest PG Solutions

USA . 1,802 parts In-Stock

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$64.902

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1,802

$64.902

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Corphita

USA . 1,322 parts In-Stock

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Overview

Upgrade your digital shift register game with the 74ACT11898N by Texas Instruments. Known for their high-quality components, Texas Instruments delivers top-notch performance and reliability. This versatile product is perfect for a wide range of applications in the digital realm. Experience faster data transfer speeds, improved efficiency, and seamless integration with this innovative solution. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for package body ensures longevity and protection of internal components.

No. of Bits: 10

10 bits provide sufficient storage capacity for shifting data in digital circuits.

Propagation Delay (tpd): 10.6 ns

Low propagation delay ensures quick data transfer within the shift register.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide operating temperature range of -40 to 85°C.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Digital Shift Registers 74ACT11898N attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

CENTER VCC/GND PINS; FLOW THROUGH ARCHITECTURE

Count Direction:

RIGHT

Family:

ACT

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

10.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

40 MHz

Trade Compliance

74ACT11898N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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