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74AC11898DWR

Texas Instruments

74AC11898DWR by Texas Instruments

74AC11898DWR by Texas Instruments is a 10-bit digital shift register with a propagation delay of 10 ns. It operates at a supply voltage range of 3V to 5.5V, making it suitable for industrial applications requiring fast data shifting and precise timing control. With positive edge triggering and compact small outline packaging, this CMOS technology-based device offers reliable performance in temperature-sensitive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,629 parts In-Stock

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3,629

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Digiode

USA . 3,394 parts In-Stock

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3,394

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Distributors (Availability)

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Native Components

USA . 387 parts In-Stock

1+ parts

$1.455

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387

$1.455

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Northwest PG Solutions

USA . 1,844 parts In-Stock

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$1.601

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1,844

$1.601

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AZTECH Wire

Italy . 336 parts In-Stock

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$6.574

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336

$6.574

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Parana Technologies

USA . 589 parts In-Stock

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$16.254

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$16.566

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589

$16.254

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$16.566

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DigiPath Technology Company

USA . 1,191 parts In-Stock

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$17.898

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1,191

$17.898

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ChromeModa Solutions

Germany . 4,313 parts In-Stock

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$18.263

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$14.976

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$18.263

$14.976

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IDEA Electronic Components Group

UK . 719 parts In-Stock

1+ parts

$18.263

100+ parts

$17.350

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$16.437

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719

$18.263

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$16.437

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One Stop Electronics

USA . 1,298 parts In-Stock

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$36.000

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Corphita

USA . 3,126 parts In-Stock

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Overview

Experience seamless digital data shifting with the 74AC11898DWR by Texas Instruments. Crafted with precision and expertise, this high-quality digital shift register offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides customers with value, efficiency, and versatility. Trust in Texas Instruments to deliver top-notch solutions that meet your needs and exceed your expectations. Elevate your projects with the 74AC11898DWR and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and reducing assembly time.

No. of Bits: 10

With 10 bits, this shift register can handle a wide range of data processing tasks.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage ensures compatibility with most electronic systems.

Propagation Delay (tpd): 10 ns

Fast propagation delay of 10 ns enables quick data transmission and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Digital Shift Registers 74AC11898DWR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

CENTER VCC/GND PINS; FLOW THROUGH ARCHITECTURE

Count Direction:

RIGHT

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

60 MHz

Trade Compliance

74AC11898DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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