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74ACT11194DWR

Texas Instruments

74ACT11194DWR by Texas Instruments

74ACT11194DWR by Texas Instruments is a 4-bit digital shift register with a propagation delay of 8.8 ns, operating at a supply voltage range of 4.5V to 5.5V. It features positive edge triggering and bidirectional count direction, making it ideal for industrial applications requiring fast data shifting and reliable performance in temperature ranges from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,157 parts In-Stock

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Digiode

USA . 3,514 parts In-Stock

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3,514

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Distributors (Availability)

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AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$16.613

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745

$16.613

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Parana Technologies

USA . 1,953 parts In-Stock

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$28.086

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$43.609

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1,953

$28.086

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$43.609

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DigiPath Technology Company

USA . 504 parts In-Stock

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$30.926

100+ parts

$28.452

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504

$30.926

$28.452

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ChromeModa Solutions

Germany . 5,990 parts In-Stock

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$31.557

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$25.877

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5,990

$31.557

$25.877

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IDEA Electronic Components Group

UK . 1,136 parts In-Stock

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$31.557

100+ parts

$29.979

1k+ parts

$28.401

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1,136

$31.557

$29.979

$28.401

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One Stop Electronics

USA . 410 parts In-Stock

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$56.000

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410

$56.000

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Corphita

USA . 3,982 parts In-Stock

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Northwest PG Solutions

USA . 874 parts In-Stock

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Native Components

USA . 472 parts In-Stock

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Overview

Experience the seamless performance and reliability of the 74ACT11194DWR digital shift register by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in every product. Ideal for various applications in electronics and automation, this compact and efficient shift register offers customers unparalleled value and benefits. Stay ahead of the competition with the superior performance and advanced features of the 74ACT11194DWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the shift register.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving space and reducing assembly time.

No. of Bits: 4

Provides enough storage capacity for a variety of digital data applications.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a common voltage level, ensuring compatibility with many systems.

Propagation Delay (tpd): 8.8 ns

Fast propagation delay ensures quick data transfer and processing speeds.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for digital applications.

Minimum fmax: 100 MHz

High maximum frequency allows for fast operation and data processing.

Technical Specifications

Digital Shift Registers 74ACT11194DWR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

HOLD MODE; CENTER VCC/GND PINS

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

8.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

100 MHz

Trade Compliance

74ACT11194DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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