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74AC11194DWR

Texas Instruments

74AC11194DWR by Texas Instruments

74AC11194DWR by Texas Instruments is a 4-bit digital shift register with a propagation delay of 10.2 ns and operates at a max frequency of 100 MHz. It is used in industrial applications for bidirectional counting, featuring positive edge trigger type and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,344 parts In-Stock

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8,344

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Digiode

USA . 4,147 parts In-Stock

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4,147

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Distributors (Availability)

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Parana Technologies

USA . 2,332 parts In-Stock

1+ parts

$7.216

100+ parts

-

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$7.718

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2,332

$7.216

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$7.718

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DigiPath Technology Company

USA . 2,201 parts In-Stock

1+ parts

$7.946

100+ parts

$7.310

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2,201

$7.946

$7.310

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$8.108

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-

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$7.297

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2,087

$8.108

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$7.297

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ChromeModa Solutions

Germany . 722 parts In-Stock

1+ parts

$8.108

100+ parts

$6.649

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722

$8.108

$6.649

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AZTECH Wire

Italy . 595 parts In-Stock

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$10.712

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595

$10.712

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One Stop Electronics

USA . 507 parts In-Stock

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$32.000

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507

$32.000

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Northwest PG Solutions

USA . 1,479 parts In-Stock

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Corphita

USA . 655 parts In-Stock

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655

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Native Components

USA . 571 parts In-Stock

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571

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Overview

Experience seamless and reliable digital shift register performance with the 74AC11194DWR by Texas Instruments. Known for their exceptional quality and expertise, Texas Instruments delivers top-notch products that exceed expectations. Ideal for a wide range of applications, this small outline package offers customers fast propagation delay, true output polarity, and bidirectional count direction. Elevate your projects with this versatile and efficient solution that guarantees value, benefits, and advantages at every turn. Choose Texas Instruments for unparalleled excellence in digital shift registers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and costs.

No. of Bits: 4

Suitable for applications requiring a 4-bit shift register, offering flexibility in design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, making it compatible with standard power sources.

Propagation Delay (tpd): 10.2 ns

Fast propagation delay ensures quick data transfer, ideal for high-speed applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization of data inputs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Minimum fmax: 100 MHz

High maximum frequency allows for efficient data processing and operation at high speeds.

Technical Specifications

Digital Shift Registers 74AC11194DWR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

PARALLEL-TO-SERIAL, SERIAL-TO-PARALLEL OPERATION ALSO AVAILABLE

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

10.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

100 MHz

Trade Compliance

74AC11194DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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