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74AC11245NSRE4

Texas Instruments

74AC11245NSRE4 by Texas Instruments

74AC11245NSRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.5 ns at 5V, suitable for industrial applications. It features a max I (ol) of 24 Amp and operates within a temperature range of -40 to 85 °C, making it ideal for bidirectional control in various electronic systems. The package style is small outline with surface mount capability, offering versatile integration options in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,967 parts In-Stock

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Digiode

USA . 766 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 866 parts In-Stock

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$9.426

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866

$9.426

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Parana Technologies

USA . 1,834 parts In-Stock

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$15.434

100+ parts

$1,433.316

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$13.891

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1,834

$15.434

$1,433.316

$13.891

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DigiPath Technology Company

USA . 1,462 parts In-Stock

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$16.995

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$15.636

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$16.995

$15.636

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ChromeModa Solutions

Germany . 2,439 parts In-Stock

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$17.342

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$14.220

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$14.220

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

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$17.342

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$16.475

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$15.608

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1,406

$17.342

$16.475

$15.608

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Andel Nordic

Denmark . 456 parts In-Stock

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$25.826

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$24.793

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$24.793

456

$25.826

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$24.793

$24.793

One Stop Electronics

USA . 1,368 parts In-Stock

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$32.000

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Component Stockers USA

USA . 314 parts In-Stock

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$99.990

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Northwest PG Solutions

USA . 2,135 parts In-Stock

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Native Components

USA . 913 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unleash the power of seamless data transmission with the Texas Instruments 74AC11245NSRE4 Bus Driver & Transceivers. Crafted with precision and expertise, Texas Instruments ensures top-notch quality and reliability. This product is designed to optimize performance in a wide range of applications, offering customers unparalleled value and benefits. Say goodbye to delays and hello to efficiency with this cutting-edge solution. Trust Texas Instruments for all your bus driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand rough handling during installation and operation.

Propagation Delay At Nominal Supply: 9.5 ns

The low propagation delay ensures fast signal transmission, making this product ideal for applications where timing is critical.

Surface Mount: YES

The surface mount option makes installation easier and saves space on the PCB, making it suitable for compact designs.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data processing tasks, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying integration into existing systems.

Power Supplies (V): 3.3/5

The option for both 3.3V and 5V power supplies provides flexibility in power requirements, enabling operation in a wider range of environments.

No. of Terminals: 24

Having 24 terminals allows for easy connection to external devices, enhancing the product's connectivity and functionality.

Maximum I (ol): 24 Amp

The high maximum output current of 24 Amps enables the product to drive power-hungry loads, making it suitable for demanding applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to be used in cold climates or industrial settings with extreme temperature variations.

Technical Specifications

Bus Driver & Transceivers 74AC11245NSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G24

Length:

15 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

74AC11245NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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